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Continuous gas plasma etching apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/306
  • C23F-001/00
출원번호 US-0862161 (1977-12-19)
우선권정보 JP-0153314 (1976-12-22)
발명자 / 주소
  • Yamamoto Shinichi (Yokohama JPX) Sumitomo Yasusuke (Yokohama JPX) Horiike Yasuhiro (Tokyo JPX) Shibagaki Masahiro (Hiratsuka JPX)
출원인 / 주소
  • Tokyo Shibaura Electric Co., Ltd. (Kawasaki JPX 03)
인용정보 피인용 횟수 : 57  인용 특허 : 1

초록

A continuous gas plasma etching apparatus comprising a reaction chamber having an inlet means and an outlet means, an activation portion disposed at a distance from said reaction chamber, a distributor means for uniformly supplying said reaction chamber with an activated gas produced in said activat

대표청구항

A continuous gas plasma etching apparatus comprising a reaction chamber having an inlet means and an outlet means; an activation portion disposed at a distance from said reaction chamber; a distributor means for uniformly supplying said reaction chamber with an activated gas produced in said activat

이 특허에 인용된 특허 (1)

  1. Ogawa Kazuyuki (Yokohama JA) Hirose Masahiko (Yokohama JA) Shibagaki Masahiro (Hiratsuka JA) Murakami Yoshio (Yokohama JA) Horiike Yasuhiro (Naritanishi JA), Activated gas reaction apparatus & method.

이 특허를 인용한 특허 (57)

  1. Fukuta Kenji (Toyota JPX) Kaneko Takaoki (Toyota JPX) Takahashi Yoshinobu (Toyota JPX), Apparatus and method for plasma treatment of resin material.
  2. Fukuta Kenji (Toyota JPX) Kaneko Takaoki (Toyota JPX) Takahashi Yoshinobu (Toyota JPX), Apparatus and method for plasma treatment of resin material.
  3. Fukuta Kenji (Toyota JPX) Kaneko Takaoki (Toyota JPX) Takahashi Yoshinobu (Toyota JPX), Apparatus and method for plasma treatment of resin material.
  4. Fukuta Kenji (Toyota JPX) Kaneko Takaoki (Toyota JPX) Takahashi Yoshinobu (Toyota JPX), Apparatus and method for plasma treatment of resin material.
  5. Uehara Akira (Yokohama JPX) Kiyota Hiroyuki (Hiratsuka JPX) Miyazaki Shigekazu (Sagamihara JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for automatic semi-batch sheet treatment of semiconductor wafers by plasma reaction.
  6. Frey Jeffrey, Apparatus for making a semiconductor device in a continuous manner.
  7. Dompas John M. A. (Olen BEX), Apparatus for the continuous manufacture of metallic anodes from molten metal.
  8. Nakane Hisashi (Kawasaki JPX) Uehara Akira (Yokohama JPX) Miyazaki Shigekazu (Sagamihara JPX) Kiyota Hiroyuki (Hiratsuka JPX) Hijikata Isamu (Tokyo JPX), Automatic apparatus for continuous treatment of leaf materials with gas plasma.
  9. Uehara, Akira; Hijikata, Isamu; Nakane, Hisashi; Nakayama, Muneo, Automatic plasma processing device and heat treatment device.
  10. Uehara, Akira; Hijikata, Isamu; Nakane, Hisashi; Nakayama, Muneo, Automatic plasma processing device and heat treatment device for batch treatment of workpieces.
  11. Fisher Jim (Hawthorne IL) Campbell ; deceased Bryant A. (late of Los Gatos CA by Louise A. Campbell ; legal representative ) Moulton Kern A. (Reno NV), Canister with plasma gas mixture for sterilizer.
  12. Imai Yoshio (No. 3-36-3 ; Horinouchi Suginami-Ku ; Tokyo JPX) Nabeta Yoichi (Machida JPX) Inuzuka Tadao (Kawasaki JPX), Capacitance humidity sensor.
  13. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  14. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartnetalized substrate processing chamber.
  15. Davies John T. (El Sobrante CA) Reichelderfer Richard F. (Castro Valley CA), Computer controlled system for processing semiconductor wafers.
  16. Westfall Raymond T. (Seminole FL) Feldl Erich J. (Seminole FL), Continuous gas plasma etching apparatus and method.
  17. Heo, Dongho; Kim, Jisoo; Sadjadi, S. M. Reza, De-fluoridation process.
  18. Heo,Dongho; Kim,Jisoo; Sadjadi,S. M. Reza, De-fluoridation process.
  19. Provence John D. (Mesquite TX) Brown Frederick W. (Colleyville TX) Jones John I. (Plano TX), Dual detector system for determining endpoint of plasma etch process.
  20. Sadjadi,S. M. Reza; Hudson,Eric A., Etch features with reduced line edge roughness.
  21. Sadjadi,S. M. Reza; Cirigliano,Peter; Kim,Ji Soo; Huang,Zhisong; Hudson,Eric A., Etch with striation control.
  22. Yamamoto Shinichi (Yokohama JPX) Sumitomo Yasusuke (Yokohama JPX) Horiike Yasuhiro (Tokyo JPX) Shibagaki Masahiro (Hiratsuka JPX), Etching apparatus using a plasma.
  23. Yang, Yixin; Mitsuhashi, Yoshiyuki; Iijima, Masayuki; Wakamatsu, Sadatsugu; Saito, Kazuhiko; Fujii, Tomoharu; Yoshimoto, Tsuyoshi; Hosoya, Togo; Hirono, Takayoshi; Hayashi, Nobuhiro; Kakutani, Nobuaki; Sunagawa, Naoki; Tada, Isao; Hirano, Hiroyuki, Film-forming apparatus.
  24. Henaff Louis (Pen an Alle 22700 Perros-Guirec FRX) Morel Michel (Pen an Alle 22700 Perros-Guirec FRX) Favennec Jean L. (16 ; cite du Vallon - St. Quay Perros 22700 Perros-Guirec FRX), Installation for depositing thin layers in the reactive vapor phase.
  25. Dompas John M. A. (Olen BEX), Metallic anodes manufactured from molten copper.
  26. Sando Yoshikazu (Wakayama JPX) Goto Tokuju (Nara JPX) Tanaka Itsuo (Osaka JPX) Ishidoshiro Hiroshi (Wakayama JPX) Minakata Matsuo (Wakayama JPX), Method for continuous treatment of a cloth with the use of low-temperature plasma and an apparatus therefor.
  27. Cann Gordon L. (17751-F Skypark East Irvine CA 92714), Micro-arc milling of metallic and non-metallic substrates.
  28. Lee, Sang Hun; Kim, Jay Joongsoo, Microwave plasma nozzle with enhanced plume stability and heating efficiency.
  29. Rieben Stuart L. (Mt. Lebanon PA), Particulate collection system for laser welding apparatus.
  30. Kumar, Satyendra; Kumar, Devendra, Plasma catalyst.
  31. Kumar,Satyendra; Kumar,Devendra, Plasma catalyst.
  32. Kumar, Satyendra; Kumar, Devendra, Plasma generation and processing with multiple radiation sources.
  33. Kumar,Satyendra; Kumar,Devendra, Plasma generation and processing with multiple radiation sources.
  34. Matsuuchi, Hidetaka; Iwasaki, Ryuichi; Mankawa, Hirofumi; Masuda, Shigeru; Hayashi, Hirofumi; Mike, Masaaki, Plasma generation apparatus and work processing apparatus.
  35. Yoshida, Kazuhiro; Iwasaki, Ryuichi; Mankawa, Hirofumi, Plasma generation apparatus and work processing apparatus.
  36. Battey James F. (66 Yerba Buena Ave. Los Altos CA 94022) Diederich Perry A. (243 MacKintosh St. Fremont CA 94538), Plasma reactor and methods for use.
  37. Gorin Georges J. (Emeryville CA) Hoog Josef T. (Novato CA), Plasma reactor apparatus.
  38. Campbell ; deceased Bryant A. (late of Los Gatos CA by Louise A. Campbell ; legal representative ) Moulton Kern A. (Reno NV) Fisher Jim (Hawthorne IL), Plasma sterilizer apparatus using a non-flammable mixture of hydrogen and oxygen.
  39. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted decrystallization.
  40. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted doping.
  41. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted enhanced coating.
  42. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted formation of carbon structures.
  43. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted gas production.
  44. Kumar, Satyendra; Kumar, Devendra; Dougherty, Michael L., Plasma-assisted heat treatment.
  45. Kumar, Devendra; Kumar, Satyendra, Plasma-assisted joining.
  46. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted joining.
  47. Kumar,Satyendra; Kumar,Devendra, Plasma-assisted melting.
  48. Kumar,Devendra; Kumar,Satyendra, Plasma-assisted nitrogen surface-treatment.
  49. Dougherty, Sr., Michael L.; Kumar, Devendra; Kumar, Satyendra, Plasma-assisted processing in a manufacturing line.
  50. Ash James J. (Centre Hall PA), Process and apparatus for chemically treating articles in a contained chamber, with sealed-door access to the chamber.
  51. Caputo Ross A. ; Amsler Thomas J. ; Du Kangyan ; Jones Jeffery ; Moulton Kern A. ; Campbell Bryant A., Process and apparatus for plasma sterilizing with pulsed antimicrobial agent treatment.
  52. Kang, Sean S.; Lee, Sangheon; Chen, Wan Lin; Hudson, Eric A.; Sadjadi, S. M. Reza; Zhao, Gan Ming, Reduction of feature critical dimensions.
  53. Kang,Sean S.; Lee,Sangheon; Chen,Wan Lin; Hudson,Eric A.; Sadjadi,S. M. Reza; Zhao,Gan Ming, Reduction of feature critical dimensions.
  54. Hudson,Eric; Sadjadi,S. M. Reza, Stabilized photoresist structure for etching process.
  55. Carlson William J. (Erie PA), Strip stacker.
  56. Kumar,Satyendra; Kumar,Devendra; Tasch,Dominique; Stroebel,Raimund, Surface cleaning and sterilization.
  57. Yuan Han-Tzong (Dallas TX) Anderson Roger N. (Garland TX), Technique of silicon epitaxial refill.
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