초록 ▼

The method of manufacturing printed circuitry with sufficiently high resolution to permit line densities of at least 1 mil lines on 3 mil centers includes the steps of placing a thickness of dry film photoresist on a smooth, polished substrate or carrier optionally, applying a thin lubricating layer

The method of manufacturing printed circuitry with sufficiently high resolution to permit line densities of at least 1 mil lines on 3 mil centers includes the steps of placing a thickness of dry film photoresist on a smooth, polished substrate or carrier optionally, applying a thin lubricating layer of spray wax to the exposed surface of the photoresist, wringing a mask defining a desired conductive circuit pattern into high integrity, intimate contact with the surface of the resist, exposing and developing the resist to remove the resist from the smooth surface in regions where the conductive circuit pattern is to be formed, electroplating the conductors within the voids formed in the resist; removing all remaining resist, laminating a flowable dielectric material to the smooth surface of the substrate and the conductive circuit pattern, and removing the laminate material and conductive circuit pattern from the smooth surface. If desired, conductive via interconnects can be selectively formed and additional layers of circuit patterns can be formed atop the first high resolution layer.

대표청구항 ▼

The method of manufacturing high line density sharp resolution printed circuitry comprising in order the steps of: placing a thickness of photosensitive material at least equal to a selected conductor thickness on a smooth, polished surface of a substrate to form a surface of photosensitive material

The method of manufacturing high line density sharp resolution printed circuitry comprising in order the steps of: placing a thickness of photosensitive material at least equal to a selected conductor thickness on a smooth, polished surface of a substrate to form a surface of photosensitive material over a given area of the smooth surface; placing a photomask defining a conductor circuit pattern adjacent the surface of the photosensitive material in intimate, continuous contact with the surface of the photosensitive material; photo exposing and developing the photosensitive material to remove said material from regions of the smooth surface where a conductive circuit pattern is to be formed; forming a conductive circuit pattern of a selected thickness in regions of the smooth surface where a conductive circuit pattern is to be formed; removing all remaining photosensitive material from the smooth surface; laminating uniformly thick preformed film of flowable insulator material to the smooth surface and conductive circuit pattern formed thereon; and stripping the insulator material and conductive circuit pattern from the smooth surface.