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Plasma plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-003/06
출원번호 US-0871314 (1978-01-23)
발명자 / 주소
  • Weiss Armin K. (Rochester NY) Clarke John R. (Rochester NY)
출원인 / 주소
  • Eastman Kodak Company (Rochester NY 02)
인용정보 피인용 횟수 : 84  인용 특허 : 1

초록

A method for forming on a substrate a relatively thick, densified, essentially non-porous, fine-grained layer of a non-conductive material. The method comprises the steps of vapor depositing onto such substrate a starting material while simultaneously bombarding the substrate with ions of a preselec

대표청구항

A method for forming on the surface of a substrate a dense, photoconductive layer of stoichiometrically balanced lead oxide, said method comprising the steps of: (a) disposing the substrate in an atmosphere of a gas comprising a mixture of oxygen and an inert gas; (b) establishing an RF electric fie

이 특허에 인용된 특허 (1)

  1. Leder Lewis B. (Rochester NY) Schottmiller John C. (Penfield NY) Schroeder Harold H. (Rochester NY), Photoreceptor fabrication.

이 특허를 인용한 특허 (84)

  1. Willett Stephen J. (St. Paul MN) Chou Hsin H. (Maplewood MN) Hendrickson Carol E. (St. Joseph Township ; St. Croix County WI) Hendrickson William A. (St. Joseph Township ; St. Croix County WI), Charge transfer media and process for making thereof.
  2. Henley Francois J. ; Cheung Nathan W., Cleaved silicon thin film with rough surface.
  3. Francois J. Henley ; Michael A. Brayan ; William G. En, Cleaving process to fabricate multilayered substrates using low implantation doses.
  4. Henley,Francois J.; Bryan,Michael A.; En,William G., Cleaving process to fabricate multilayered substrates using low implantation doses.
  5. Trude, Gregory, Container and method for blowmolding a base in a partial vacuum pressure reduction setup.
  6. Kelley, Paul; Goss, Kent; Sheets, Philip; Lyon, Ted; Ryl-Kuchar, Charles A., Container handling system.
  7. Henley Francois J. ; Cheung Nathan W., Controlled cleaning process.
  8. Francois J. Henley ; Nathan Cheung, Controlled cleavage process and device for patterned films.
  9. Henley Francois J. ; Cheung Nathan, Controlled cleavage process and device for patterned films.
  10. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process and device for patterned films.
  11. Francois J. Henley ; Nathan W. Cheung, Controlled cleavage process and resulting device using beta annealing.
  12. Henley Francois J. ; Cheung Nathan W., Controlled cleavage process and resulting device using beta annealing.
  13. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
  14. Henley, Francois J.; Cheung, Nathan, Controlled cleavage process using pressurized fluid.
  15. Henley Francois J. ; Cheung Nathan, Controlled cleavage system using pressurized fluid.
  16. Henley Francois J. ; Cheung Nathan W., Controlled cleavage thin film separation process using a reusable substrate.
  17. Henley, Francois J.; Cheung, Nathan W., Controlled cleaving process.
  18. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
  19. Henley,Francois J.; Cheung,Nathan W., Controlled cleaving process.
  20. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  21. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  22. Henley, Francois J.; Cheung, Nathan W., Controlled process and resulting device.
  23. Henley,Francois J.; Cheung,Nathan W., Controlled process and resulting device.
  24. Kelley, Paul V.; Bysick, Scott E., Deformable container with hoop rings.
  25. Henley Francois J. ; Cheung Nathan, Device for patterned films.
  26. Henley Francois J. ; Cheung Nathan W., Economical silicon-on-silicon hybrid wafer assembly.
  27. Nathan W. Cheung ; Francois J. Henley, Generic layer transfer methodology by controlled cleavage process.
  28. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
  29. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
  30. Rothschild Mordechai (Newton MA) Black Jerry G. (Lincoln MA) Ehrlich Daniel J. (Lexington MA), Hydrolysis-induced vapor deposition of oxide films.
  31. Joly, Jean-Pierre; Ulmer, Laurent; Parat, Guy, Integrated circuit on high performance chip.
  32. Ferralli Michael W. (10580 E. Lake Rd. North East PA 16428), Ion induced thin surface coating.
  33. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
  34. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
  35. Kelley, Paul, Method and apparatus for manufacturing blow molded containers.
  36. Francois J. Henley ; Nathan W. Cheung, Method and device for controlled cleaving process.
  37. Henley Francois J. ; Cheung Nathan, Method and device for controlled cleaving process.
  38. Henley Francois J. ; Cheung Nathan W., Method and device for controlled cleaving process.
  39. Henley, Francois J.; Cheung, Nathan W., Method and device for controlled cleaving process.
  40. Henley,Francois J.; Cheung,Nathan, Method and device for controlled cleaving process.
  41. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
  42. Kelley, Paul V.; Bysick, Scott B., Method and system for handling containers.
  43. Fournel, Franck; Moriceau, Hubert; Lagahe, Christelle, Method for making a stressed structure designed to be dissociated.
  44. Hashimoto, Eigo; Nanya, Takanori, Method for making oxide based electrochromic display devices.
  45. Tauzin, Aurélie; Dechamp, Jérôme; Mazen, Frédéric; Madeira, Florence, Method for preparing thin GaN layers by implantation and recycling of a starting substrate.
  46. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle; Bourdelle, Konstantin; Tauzin, Aurélie; Fournel, Franck, Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation.
  47. Asmussen Jes (Okemos MI) Reinhard Donnie K. (East Lansing MI), Method for treating a surface with a microwave or UHF plasma and improved apparatus.
  48. Nath Prem (Rochester MI), Method of depositing a highly conductive, highly transmissive film.
  49. Kelley, Paul V.; Bysick, Scott E.; Lynch, Brian A.; Nahill, Thomas E.; Philippe, Romuald, Method of making plastic container having a deep-inset base.
  50. Aspar, Bernard; Bruel, Michel; Poumeyrol, Thierry, Method of producing a thin layer of semiconductor material.
  51. Cheung Nathan W. ; Lu Xiang ; Hu Chenming, Method of separating films from bulk substrates by plasma immersion ion implantation.
  52. Deguet, Chrystel; Clavelier, Laurent; Dechamp, Jerome, Method of transferring a thin film onto a support.
  53. Fournel, Franck, Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer.
  54. Trude, Greg; Tobias, John W.; Ogg, Richard K., Multi-functional base for a plastic, wide-mouth, blow-molded container.
  55. Malik, Igor J.; Kang, Sien G.; Fuerfanger, Martin; Kirk, Harry; Flat, Ariel; Current, Michael Ira; Ong, Philip James, Non-contact etch annealing of strained layers.
  56. Bryan Michael A. ; Kai James K., Nozzle for cleaving substrates.
  57. Bryan, Michael A.; Kai, James K., Nozzle for cleaving substrates.
  58. Haque Reza (Hamden CT) Smith ; III Edward F. (Madison CT) Kadija Igor V. (Cheshire CT), One-step plasma treatment of copper foils to increase their laminate adhesion.
  59. Haque Reza (Hamden CT) Smith ; III Edward F. (Madison CT) Kadija Igor V. (Cheshire CT), One-step plasma treatment of copper foils to increase their laminate adhesion.
  60. Corbett Richard T. (Cambuslang GB6) Monachan Brian C. (Glasgow GB6) Hope Alexander J. N. (Glasgow GB6), Optical coating.
  61. Sathrum Paul E. ; Coll Bernard F., Plasma enhancement apparatus and method for physical vapor deposition.
  62. Wurster, Michael P.; Bysick, Scott E., Plastic containers having base configurations with up-stand walls having a plurality of rings, and systems, methods, and base molds thereof.
  63. Wurster, Michael P.; Bysick, Scott E., Plastic containers, base configurations for plastic containers, and systems, methods, and base molds thereof.
  64. Henley Francois J. ; Cheung Nathan W., Pre-semiconductor process implant and post-process film separation.
  65. Henley Francois J. ; Cheung Nathan W., Pressurized microbubble thin film separation process using a reusable substrate.
  66. Bruel,Michel, Process for the production of thin semiconductor material films.
  67. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film.
  68. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
  69. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
  70. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
  71. Henley Francois J. ; Cheung Nathan W., Reusable substrate for thin film separation.
  72. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon hybrid wafer assembly.
  73. Henley, Francois J.; Cheung, Nathan W., Silicon-on-silicon hybrid wafer assembly.
  74. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon wafer bonding process using a thin film blister-separation method.
  75. Harper James M. E. (Yorktown Heights NY) Kleinsasser Alan W. (Putnam Valley NY), Single axis combined ion and vapor source.
  76. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
  77. Bryan Michael A. ; Kai James K., Substrate cleaving tool and method.
  78. Bryan, Michael A.; Kai, James K., Substrate cleaving tool and method.
  79. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  80. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  81. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
  82. Brailove, Adam; Liu, Zuqin; Henley, Francois J.; Lamm, Albert J., Techniques for forming thin films by implantation with reduced channeling.
  83. Haque Reza (Hamden CT) Smith ; III Edward F. (Madison CT), Three-step plasma treatment of copper foils to enhance their laminate adhesion.
  84. Haque Reza (Hamden CT) Smith ; III Edward F. (Madison CT), Three-step plasma treatment of copper foils to enhance their laminate adhesion.
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