[특허]Anisotropic resistance bonding technique

[미국특허] Anisotropic resistance bonding technique 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B29C-019/06
출원번호	US-0852113 (1977-11-16)
발명자 / 주소	Hutcheson Edward T. (Stafford VA)
출원인 / 주소	The United States of America as represented by the Secretary of the Army (Washington DC 06)
인용정보	피인용 횟수 : 38 인용 특허 : 2

초록 ▼

A method of making electrical connections between large-scale integrated circuit boards or the like using a plastic adhesive charged with conductive particles. The method includes the steps of: coating one board with the adhesive, placing another board on the adhesive coating, applying a field to make the conductive whiskers align perpendicular to the boards, and hardening the adhesive while the field is applied. The field may be electric or magnetic, depending on whether the whiskers are paramagnetic or ferromagnetic.

대표청구항 ▼

A method of making electrical connections between two surfaces, wherein each surface has conductive areas and insulating areas including the the steps of: (a) coating one surface with a plastic adhesive charged with paramagnetic conductive whiskers; (b) placing the other surface on said coating; (c) applying an aligning electric field to said coating to cause said whiskers to align perpendicular to said surfaces; and (d) hardening said adhesive while said field is applied.

이 특허에 인용된 특허 (2) 인용/피인용 타임라인 분석

Peart Leland L. (San Clemente CA) Schiavo John S. (Placentia CA), Copper surface treatment for epoxy bonding.
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Fick Herbert J. (Northfield MN) Mahagnoul Edward J. (Faribault MN), Electrical laminate.
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이 특허를 인용한 특허 (38) 인용/피인용 타임라인 분석

Khanna, S. Kumar, Anisotropic conductive adhesive with reduced migration.
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Khanna, S. Kumar, Anisotropic conductive compound.
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Kawaguchi Toshiyuki (Ageo JPX) Suzuki Hideki (Omiya JPX), Anisotropically electroconductive film adhesive.
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Koepke Barry G. (Mound MN) McHenry Kelly D. (Eden Praire MN), Composite electronic substrate of alumina uniformly needled through with aluminum nitride.
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Giacomel, Jeffrey A., Composite matrix with oriented whiskers.
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Glowasky Robert A. ; Jacobs Jack H. ; McIlroy Bruce E. ; Thomas Matthew M., Composite structure having an externally accessible electrical device embedded therein and a related fabrication method.
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Glowasky Robert A. ; Jacobs Jack H. ; McIlroy Bruce E. ; Thomas Matthew M., Composite structure having an externally accessible electrical device embedded therein and a related fabrication method.
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McArdle Ciaran Bernard,IEX ; Burke Joseph,IEX, Compositions and method for providing anisotropic conductive pathways and bonds between two sets of conductors.
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McArdle Ciaran Bernard,IEX ; Burke Joseph,IEX, Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors.
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Fukui, Keiko; Nagasawa, Hideo; Niitsu, Toshihiro; Suzuki, Hirokazu, Connector having an anisotropic conductive film.
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Glowasky Robert A. ; Jacobs Jack H. ; McIlroy Bruce E. ; Thomas Matthew M., Connector tow.
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Chappell, William J.; Moon, Sungwook; Rojas, Nestor A., Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles.
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O'Connor, Jason Daniel Harold, Electrical heating element.
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Burnham, Kenneth; Skov, Richard, Electrically conductive materials formed by electrophoresis.
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Burnham, Kenneth; Skov, Richard, Electrically conductive materials formed by electrophoresis.
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Tamura Koetsu,JPX ; Hasegawa Shinichi,JPX, Electronic assembly package including connecting member between first and second substrates.
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Tamura Koetsu,JPX ; Hasegawa Shinichi,JPX, Electronic device assembly and a manufacturing method of the same.
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McArdle Ciaran B.,IEX ; Burke Joseph,IEX, Films and coatings having anisotropic conductive pathways therein.
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Skinner, Michael P.; Ossiander, Teodora; Albers, Sven; Seidemann, Georg, Magnetic contacts.
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Skinner, Michael P.; Ossiander, Teodora; Albers, Sven; Seidemann, Georg, Magnetic contacts.
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Skinner, Michael P.; Ossiander, Teodora; Albers, Sven; Seidemann, Georg, Magnetic contacts.
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Kim, Yong K.; Lewis, Armand F.; Rice, John M., Materials methodology to improve the delamination strength of laminar composites.
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Buchanan, Mark; Knaapila, Matti; Helgesen, Geir; Hoeyer, Henrik, Method for assembling conductive particles into conductive pathways and sensors thus formed.
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Khanna, S. Kumar, Method for curing an anisotropic conductive compound.
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Yang,Seung Taek, Method for fabricating semiconductor package.
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Schade Reinhart (Olching DEX), Method for making contact with the electrode on the adhesive-coated side of an electrical component and the article made.
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McArdle Ciaran B.,IEX ; Burke Joseph,IEX ; Welch ; II Edward K., Method of forming a monolayer of particles.
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McArdle, Ciaran Bernard; Barnes, Rory Brian, Method of forming a monolayer of particles having at least two different sizes, and products formed thereby.
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Ciaran B. McArdle IE; Joseph Burke IE; Edward K. Welch, II, Method of forming a monolayer of particles, and products formed thereby.
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McArdle Ciaran B.,IEX ; Burke Joseph,IEX ; Welch ; II Edward K., Method of forming a monolayer of particles, and products formed thereby.
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McArdle Ciaran B.,IEX ; Burke Joseph,IEX, Method of making films and coatings having anisotropic conductive pathways therein.
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Kessler, Seth S.; Raghavan, Ajay; Wardle, Brian L., Multifunctional CNT-engineered structures.
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Kessler, Seth S.; Raghavan, Ajay; Wardle, Brian L., Multifunctional CNT-engineered structures.
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Steigerwald Wolf-Erhard (Rua de Fez ; 731 4.000 Porto PTX) Ambros Peter (Am Wacholderrain 12 8741 Hohenroth Ortsteil Leutershausen DEX) Gatzke Erich (Wilhelm-Busch-Str. 56 3260 Rinteln DEX), Paste composition for the production of electrically conductive and solderable structures.
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Sognefest, Peter W.; Khanna, S. Kumar; Ferraro, Fernando A., Radiation detector assembly.
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Burnham, Kenneth; Skov, Richard; Tomas, Stephen; Nguyen, Jimmy; Pizzo, Stephen M.; Crislip, Lisa, Systems and methods for providing surface connectivity of oriented conductive channels.
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Wardle, Brian L.; Guzman de Villoria, Roberto; Miravete, Antonio, Systems and methods for structural sensing.
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Khanna, S. Kumar, UV-curable anisotropic conductive adhesive.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Anisotropic resistance bonding technique 원문보기