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특허 상세정보

Sealing glass composition

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C03C-003/12    C03C-003/14    C03C-003/30    C03C-012/00   
미국특허분류(USC) 106/53 ; 106/19 ; 106/47R ; 106/54
출원번호 US-0901467 (1978-05-01)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 34  인용 특허 : 1
초록

Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu2O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, and up to 5% by weight bismuth oxide. These glasses may be mixed with particulate refractory fillers in amounts up to about 56% by volume. The sealing glasses are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.

대표
청구항

A sealing glass comprising a homogeneous mixture of lead oxide, zinc oxide, boron oxide, bismuth oxide, silicon dioxide, cuprous oxide and a minor proportion of at least one solid non-volatile metal fluoride, the proportions being lead oxide about 75 to 85 wt %, boron oxide about 8 to 15 wt %, zinc oxide up to 10 wt %, silicon dioxide 0.75 to 2.5 wt %, bismuth oxide to 5 wt %, cuprous oxide 0.5 to 5.5 wt % and non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1:0.2...

이 특허를 인용한 특허 피인용횟수: 34

  1. Young, Dianna M.. Articles sealed with glass. USP2003076586087.
  2. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP20181110125045.
  3. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016069359247.
  4. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016109458052.
  5. Snitzer Elias (West Hartford CT) Bacon James F. (Manchester CT). Composite bonding. USP1983084397961.
  6. Dumesnil Maurice E. (Los Altos Hills CA) Starz Karl (Rodenbach CA DEX) Finkelshteyn Leonid (San Francisco CA). Die/attach composition. USP1987104699888.
  7. Ahearn John E. (Middleboro MA) Frates Raymond A. (Fairhaven MA) Girard Dennis (New Bedford MA) Koepke Richard A. (New Bedford MA) O\Hern Robert M. (Taunton MA) Schmidt James K. (Mt. Pleasant PA) Mano. Duplex glass preforms for hermetic glass-to-metal compression sealing. USP1988114788382.
  8. Ahearn John E. (Middleboro MA) Frates Raymond A. (Fairhaven MA) Girard Dennis (New Bedford MA) Koepke Richard A. (New Bedford MA) Schmidt James K. (Mt. Pleasant PA) Manon C. Dodd (Ligonier PA). Duplex glass preforms for hermetic glass-to-metal sealing. USP1987124716082.
  9. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL). Electronic packaging of components incorporating a ceramic-glass-metal composite. USP1991065024883.
  10. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL). Electronic packaging of components incorporating a ceramic-glass-metal composite. USP1989114882212.
  11. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Frits for use in vacuum insulating glass (VIG) units, and/or associated methods. USP2018069988302.
  12. Rita Robert A. (Lake Katrine NY). Gas panel seal glass. USP1984104478947.
  13. Nelson John W. (Painted Post NY) Pinckney Linda R. (Corning NY). Lead-free glasses for glaze materials. USP1989034814298.
  14. Pirooz Perry P. (Toledo OH). Low temperature sealant glass. USP1982124365021.
  15. Matsuura, Ichiro; Yamaguchi, Fumio. Low temperature sealing composition. USP1985084537863.
  16. Matsuura Ichiro (Otsu JPX) Yamaguchi Fumio (Shiga JPX). Low temperature sealing glass. USP1982014310357.
  17. Gurol I. Macit (Strafford PA). Method of making a hermetically sealed electronic component. USP1990034906311.
  18. Dennis, Timothy A.. Method of making vacuum insulated glass (VIG) window unit. USP20181010107028.
  19. Pirooz Perry P. (Toledo OH). Sealing glass and method of making a Willemite filler therefor. USP1985064522925.
  20. Smith ; III Edward F. (Madison CT). Sealing glass composite. USP1988104775647.
  21. Smith Edward F. (Madison CT). Sealing glass composite. USP1989014801488.
  22. Seki Hiroshi (Funabashi JPX) Nishiyuki Toshiki (Chiba JPX). Sealing glass composition. USP1987114704370.
  23. Yamanaka Toshio (Shiga JPX) Yamaguchi Fumio (Shiga JPX). Sealing glass composition with lead calcium titanate filler. USP1987124710479.
  24. Finkelstein Leo (San Francisco CA) Dumesnil Maurice E. (Los Altos Hills CA) Tetschlag Richard R. (San Jose CA). Sealing glass compositions. USP1991055013360.
  25. Kokubu Yoshinori (Tokyo JPX) Chiba Jiro (Yokohama JPX) Ichimura Nobuyoshi (Yokohama JPX) Iwai Takashi (Yachiyo JPX) Kawaguchi Toshiyasu (Yokohama JPX). Sealing glass compositions. USP1983094405722.
  26. Starz Karl-Anton (Rodenbach DEX) Metzner Mathias (Kleinostheim DEX) Weber Wolfgang (Karlstein DEX). Solder paste for fastening semiconductors onto ceramic bases. USP1990104962066.
  27. Suehiro, Yoshinobu; Inoue, Mitsuhiro; Kato, Hideaki; Hadame, Kunihiro; Tohmon, Ryoichi; Wada, Satoshi; Ota, Koichi; Aida, Kazuya; Watanabe, Hiroki; Yamamoto, Yoshinori; Ohtsuka, Masaaki; Sawanobori, Naruhito. Solid element device and method for manufacturing the same. USP2014048685766.
  28. Suehiro, Yoshinobu; Inoue, Mitsuhiro; Kato, Hideaki; Hadame, Kunihiro; Tohmon, Ryoichi; Wada, Satoshi; Ota, Koichi; Aida, Kazuya; Watanabe, Hiroki; Yamamoto, Yoshinori; Ohtsuka, Masaaki; Sawanobori, Naruhito. Solid element device and method for manufacturing the same. USP2010117824937.
  29. Takami Akio (Aichi JPX) Kondo Kazuo (Aichi JPX). Tin oxide, titanium oxide and/or zirconium oxide coated b
  30. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same. USP2017039593527.
  31. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20181010087676.
  32. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP2017109776910.
  33. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20190210196299.
  34. Dennis, Timothy A.. Vanadium-based frit materials, binders, and/or solvents and methods of making the same. USP2016049309146.