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Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0903397 (1978-05-08)
우선권정보 JP-0016469 (1976-02-14)
발명자 / 주소
  • Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX)
출원인 / 주소
  • Sony Corporation (Tokyo JPX 02)
인용정보 피인용 횟수 : 61  인용 특허 : 4

초록

In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.

대표청구항 ▼

In a cooling assembly including a heat generating electric part having leads, a heat conductive block mounting said heat generating electric part, and a heat pipe attached to said heat conductive block for radiating the heat from said heat generating electric part to the air through said heat conduc

이 특허에 인용된 특허 (4)

  1. Arii ; Hiroshi ; Kawada ; Hirohito ; Yoshida ; Takashi ; Nonaka ; Chiaki, Apparatus for cooling electrical components.
    상세보기
  2. Schumacher Frank A. (Louisville KY), Automatic ice maker utilizing heat pipe.
    상세보기
  3. Grover George M. (Los Alamos NM), Heat pipe and method and apparatus for fabricating same.
    상세보기
  4. Haws James L. (Plano TX) Quinney Douglas W. (Plano TX) Richards Frank A. (Dallas TX), Heat pipe cooling of airborne phased array radar.
    상세보기

이 특허를 인용한 특허 (61)

  1. Pustelnik, Philipp; Euler-Rolle, Thomas, Adapter bit for a device for connecting pipe conduits.
    상세보기
  2. Rice, Lawrence M., Automotive lighting assembly cooling system.
    상세보기
  3. Cochimin Jimmy, Clamp and cup securing strain gauge cell adjacent pressure transmitting diaphragm.
    상세보기
  4. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
    상세보기
  5. Cheon Kioan, Cooling apparatus for electronic devices.
    상세보기
  6. Dong Gyu Lee KR; Jae Sea Koo KR, Cooling device of linear power amplifier in mobile communication system.
    상세보기
  7. Nakazato Norio,JPX ; Hirasawa Shigeki,JPX ; Masukawa Shoji,JPX ; Kuwahara Heikichi,JPX, Cooling device with thermally separated electronic parts on a monolithic substrate.
    상세보기
  8. Sano Toshifumi (Tokyo JPX), Cooling structure.
    상세보기
  9. Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX), Cooling structure for heat generating electronic components mounted on a substrate.
    상세보기
  10. Umezawa, Kazuhiko, Cooling system for IC package.
    상세보기
  11. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
    상세보기
  12. Mine Shinji (Tokyo JPX), Cooling system for three-dimensional IC package.
    상세보기
  13. Umezawa Kazuhiko (Tokyo JPX), Cooling unit.
    상세보기
  14. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
    상세보기
  15. Tajima Makoto,JPX, Electronic component cooling unit.
    상세보기
  16. Tong, Tao; LeToquin, Ronan; Keller, Bernd; Ibbetson, James; Negley, Gerald, Enhanced color rendering index emitter through phosphor separation.
    상세보기
  17. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
    상세보기
  18. Lai, Cheng Tien; Jiang, Shuai, Heat dissipating assembly with heat pipes.
    상세보기
  19. Garner Scott D. ; Toth Jerome E., Heat dissipating computer case having oriented fibers and heat pipe.
    상세보기
  20. Moore David A., Heat dissipating pad structure for an electronic component.
    상세보기
  21. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
    상세보기
  22. Chen, Chun-Chi; Fu, Meng, Heat dissipation device.
    상세보기
  23. Chen, Chun-Chi; Fu, Meng, Heat dissipation device.
    상세보기
  24. Lee, Kuo-Shao, Heat dissipation device comprised of multiple heat sinks.
    상세보기
  25. Garner, Scott, Heat dissipation unit with direct contact heat pipe.
    상세보기
  26. James Kevin Azotea, Heat exchanging chassis.
    상세보기
  27. Ito Akira,JPX, Heat pipe method for making the same and radiating structure.
    상세보기
  28. Chen, Chun-Chi; Fu, Meng, Heat pipe type heat dissipation device.
    상세보기
  29. Katsui, Tadashi, Heat sink and information processor using heat sink.
    상세보기
  30. Le, Long Larry; Letoquin, Ronan; Keller, Bernd; Tarsa, Eric; Pickard, Paul; Lay, James Michael; Tong, Tao; Youmans, Mark; Lowes, Theodore; Medendorp, Jr., Nicholas W.; Van De Ven, Antony; Negley, Gerald, High efficiency solid state lamp and bulb.
    상세보기
  31. Le, Long Larry; Pickard, Paul; Lay, James Michael; Tong, Tao; Letoquin, Ronan; Keller, Bernd; Tarsa, Eric; Youmans, Mark; Lowes, Theodore; Medendorp, Jr., Nicholas W.; Van De Ven, Antony; Negley, Gerald, High efficiency solid state lamp and bulb.
    상세보기
  32. Keller, Bernd; Ibbetson, James, High power solid-state lamp.
    상세보기
  33. Fitch John S. ; Hamburgen William R., Independently mounted cooling fins for a low-stress semiconductor package.
    상세보기
  34. Brownell Michael ; McCutchan Dan ; Xie Hong ; Haley Kevin, Injection molded thermal interface system.
    상세보기
  35. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.
    상세보기
  36. Patel Janak G., Integrated heatsink and heatpipe.
    상세보기
  37. Tong, Tao; LeToquin, Ronan; Keller, Bernd; Lowes, Theodore; Tarsa, Eric; Youmans, Mark, LED based pedestal-type lighting structure.
    상세보기
  38. Tong, Tao; Letoquin, Ronan; Keller, Bernd; Tarsa, Eric, LED lamp incorporating remote phosphor with heat dissipation features.
    상세보기
  39. Tong, Tao; Le Toquin, Ronan; Keller, Bernd; Tarsa, Eric; Youmans, Mark; Lowes, Theodore; Medendorp, Jr., Nicholas W.; Van De Ven, Antony; Negley, Gerald, LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties.
    상세보기
  40. Tong, Tao; Youmans, Mark; He, Yejin, LED lamp with active cooling element.
    상세보기
  41. Tong, Tao; Youmans, Mark; He, Yejin, LED lamp with active cooling element.
    상세보기
  42. Yu, Guang; Zheng, Shi Song; He, Li, LED lamp with heat dissipation device.
    상세보기
  43. Tong, Tao; Le Toquin, Ronan; Keller, Bernd; Tarsa, Eric; Youmans, Mark; Lowes, Theodore; Medendorp, Jr., Nicholas W.; Van De Ven, Antony; Negley, Gerald, LED lamp with remote phosphor and diffuser configuration.
    상세보기
  44. Yuan, Zongjie; Tarsa, Eric; Tong, Tao; Letoquin, Ronan; Keller, Bernd; Le, Long Larry; Lay, James Michael; Demuynck, Randolph Cary, LED lamp with remote phosphor and diffuser configuration utilizing red emitters.
    상세보기
  45. Progl, Curt, Lamp structure with remote LED light source.
    상세보기
  46. Progl, Curt; Athalye, Praneet; Negley, Gerald, Lamp with remote LED light source and heat dissipating elements.
    상세보기
  47. Chang,Chih Chin; Huang,Teng Huei; Lee,Chien Lung, Light module with combined heat transferring plate and heat transferring pipes.
    상세보기
  48. Zhang,Long Bao, Light source with heat transfer arrangement.
    상세보기
  49. Liao, Yun-Chang, Light-emitting diode module with heat dissipating structure.
    상세보기
  50. Liao, Yun Chang, Light-emitting diode module with heat dissipating structure and lamp with light-emitting diode module.
    상세보기
  51. Cochimin Jimmy ; Halsey Richard J., Liquid pumping system with cooled control module.
    상세보기
  52. Albrecht, Adam, MRT-RF push pull power modules.
    상세보기
  53. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
    상세보기
  54. French,F. William; Merrill,Leonard A., Method and apparatus for dispersing heat from high-power electronic devices.
    상세보기
  55. Garner, Scott, Method for forming a heat dissipation device.
    상세보기
  56. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
    상세보기
  57. Le, Long Larry; Progl, Curtis; Lay, James Michael; Blackwell, Ronald; James, Sr., Malcolm D.; Poncheri, Michael D.; Taylor, Jason, Passive phase change radiators for LED lamps and fixtures.
    상세보기
  58. Nikfar,Nader, RF power amplifier assembly with heat pipe enhanced pallet.
    상세보기
  59. Sarraf David B. ; Toth Jerome E. ; Gernert Nelson J., Stress relieved integrated circuit cooler.
    상세보기
  60. Umezawa Kazuhiko (Tokyo JPX), Structure for temperature detection in a package.
    상세보기
  61. Cheng,Chia Chun, Water-cooling heat dissipator.
    상세보기

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