초록 ▼

A method of forming particle board characterized by the use of an adhesive comprising a polyisocyanate and a phenolic adhesive. Enhanced adhesive characteristics and other advantages are associated with the method in which the polyisocyanate is added to the wood particles, etc. prior to application

A method of forming particle board characterized by the use of an adhesive comprising a polyisocyanate and a phenolic adhesive. Enhanced adhesive characteristics and other advantages are associated with the method in which the polyisocyanate is added to the wood particles, etc. prior to application of the phenolic adhesive.

대표청구항 ▼

In a method of fabricating particle board and the like, wherein an organic polyisocyanate/phenolic resin adhesive is applied to wood furnish with subsequent application of heat and pressure to form the desired product, the improvement comprising the steps of: applying said polyisocyanate/phenolic re

In a method of fabricating particle board and the like, wherein an organic polyisocyanate/phenolic resin adhesive is applied to wood furnish with subsequent application of heat and pressure to form the desired product, the improvement comprising the steps of: applying said polyisocyanate/phenolic resin adhesive wherein said adhesive comprises: (i) from about 10% to about 50% by weight of the organic polyisocyanate; and (ii) from about 50% to about 90% by weight of the phenolic resin; wherein said application comprises the steps of: (a) applying first to the wood furnish the organic polyisocyanate; and (b) applying next to the wood furnish the phenolic resin; and applying next to the resulting wood furnish/adhesive product sufficient heat and pressure to form the desired product.