초록 ▼

A solderless electrical connector comprising a printed circuit board and electrical contact terminals mounted therein. A printed circuit board is fabricated to the construction stage wherein conductive circuitry interconnects plated through holes formed therethrough. The exposed circuitry and plated

A solderless electrical connector comprising a printed circuit board and electrical contact terminals mounted therein. A printed circuit board is fabricated to the construction stage wherein conductive circuitry interconnects plated through holes formed therethrough. The exposed circuitry and plated through holes are covered with a conformal coating of insulative material which seals the outer surfaces of the conductive materials from the environment and its effects. The insulative coating obviates the need for solder to protect the conductive materials as well as precludes the use of solder for electrical interconnection therewith. The plated through holes are constructed for press fit insertion of contact terminals in tight frictional engagement therein. The press fit insertion of a contact having an angular edge portion effectively penetrates the insulative coating by deforming it away from that portion of the plated through hole brought to bear against the contact. A mechanical and electrical interconnection is thereby provided between the plated through hole and contact terminal of the press fit assembly while the utilization of solder and the requisite heat thereof is effectively eliminated.

대표청구항 ▼

An improved method of manufacturing a printed circuit board assembly of the type having an insulative mounting substrate including patterns of conductive material upon at least one surface thereof and holes in the board extending through portions of the conductive patterns, the holes being plated wi

An improved method of manufacturing a printed circuit board assembly of the type having an insulative mounting substrate including patterns of conductive material upon at least one surface thereof and holes in the board extending through portions of the conductive patterns, the holes being plated with a conductive material which is in electrical contact with the conductive pattern adjacent the holes; wherein the improvement comprises the steps of immersing said board in a fluid medium of dielectric material adapted for adhering to exposed surfaces immersed therein; withdrawing said board from said fluid medium and allowing excess dielectric material to drain therefrom so that the remainder of the material forms a thin film upon said board; drawing a gaseous fluid through the holes in said board to form a thin film of dielectric material uniformly along the side walls thereof; curing said dielectric material into a solid insulative coating upon said board and along the side walls of the holes formed therein; and press fitting a conductive contact having an angular edge portion directly through said insulatively coated holes with said edge penetrating said insulative coating and engaging the conductive material thereunder to deform the conductive material around said edge portion and effect a tight and rigid electrical and mechanical interengagement.