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Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manuf 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/32
출원번호 US-0931686 (1978-08-07)
우선권정보 FR-0040361 (1975-12-31)
발명자 / 주소
  • Badet Bernard (Rosny FRX) Guillaume Francois (St. Leu la Foret FRX) Kurzweil Karel (Eaubonne FRX)
출원인 / 주소
  • Compagnie Internationale pour l\Informatique Cii-Honeywell Bull (Societe Anonyme) (Paris FRX 03)
인용정보 피인용 횟수 : 35  인용 특허 : 3

초록

A standardized access card is formed of a single or a pair of bonded sheets of material including a cavity within which is disposed an integrated circuit assembly for processing electrical signals arranged within the card. The thickness of the assembly is relatively smaller than the thickness of the

대표청구항

A method of producing cards adapted to provide access to a system for processing electrical signals, comprising: providing a plurality of sheets, each having at least one cavity and being of a predetermined surface area and thickness and having associated contact positions adjacent said cavity, prov

이 특허에 인용된 특허 (3)

  1. Winrow Donald (Weston CA) Smith Charles Norman (Mississauga CA), Magnetically actuable element and method of making.
  2. Noe Terry Wayne (Richardson TX), Method and apparatus for the assembly of semiconductor devices.
  3. Elarde Paul F. (Naperville IL) Klasek F. A. (LaGrange Park IL) McCormick George O. (LaGrange IL), Method for forming a magnet pattern on magnetic memory circuit cards.

이 특허를 인용한 특허 (35)

  1. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Carrier element for an IC module.
  2. Obrecht Werner (Wielenbach DEX) Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Carrier element for an IC module.
  3. Haghiri-Tehrani Yahya (Mnchen DEX) Barak Rene-Lucia (Unterhaching DEX), Carrier element to be incorporated into an identity card.
  4. DiStefano, Thomas H.; Karavakis, Konstantine; Mitchell, Craig; Smith, John W., Compliant integrated circuit package.
  5. Distefano Thomas H. ; Karavakis Konstantine ; Mitchell Craig ; Smith John W., Compliant integrated circuit package and method of fabricating the same.
  6. Daniel A. Henderson ; Darren Townsley, Dialer programming and device with integrated printing process.
  7. Henderson Daniel A. ; Townsley Darren, Dialer programming system and device with integrated printing process.
  8. Simula, Tomi; Bräysy, Vinski; Heikkinen, Mikko; Hintikka, Juha-Matti; Harvela, Juhani; Pirkonen, Minna; Raappana, Pasi; Heikkilä, Tuomas; Sääski, Jarmo, Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node.
  9. Ragan Lawrence H. (Dallas TX) Hartmann Clinton S. (Carrollton TX) Ash Darrell L. (Garland TX), Electronic ticket method and apparatus for television signal scrambling and descrambling.
  10. Kitchener Robert A. (Armonk NY), IC card and an identification system thereof.
  11. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Identification card with an IC-module and method for producing it.
  12. Hoppe Joachim (Munich DEX), Identification card with integrated circuit.
  13. Moreno Roland C. D. (30-32 ; Bvd de Strasbourg Paris FRX 75010), Method and apparatus for electrically connecting a removable article, in particular a portable electronic card.
  14. Dehaine Grard (Chatillon FRX) Peytavy Alain (Versailles FRX), Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electron.
  15. Misvaer, Tonia; Baiardi, Richard; Naficy, Mariam B., Method for generating letterpressed products.
  16. Katagiri Shuhei (Tokyo JPX) Donuma Kenichi (Koshigaya JPX) Ohashi Makoto (Kawasaki JPX), Method for manufacturing a module for a fiber optic link.
  17. Rose Ren (Voisin le Bretonneux FRX), Method for manufacturing memory cards.
  18. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Method for producing a carrier element for an IC-chip.
  19. Huber Michael,DEX ; Stampka Peter,DEX ; Houdeau Detlef,DEX ; Fischer Jurgen,DEX ; Heitzer Josef,DEX ; Graf Helmut,DEX, Method for producing a carrier element for semiconductor chips.
  20. Hoppe Joachim,DEX ; Hohmann Arno,DEX, Method for producing data carriers with embedded elements.
  21. Hoppe Joachim,DEX ; Hohmann Arno,DEX, Method for producing data carriers with embedded elements and an apparatus for carrying out the method.
  22. DiStefano, Thomas H.; Karavakis, Konstantine; Mitchell, Craig; Smith, John W., Method of making a compliant integrated circuit package.
  23. Mollet Jean P. (La Celle Saint Cloud FRX) Rose Ren (Voisin le Bretonneux FRX), Method of making cards having graphics elements thereon.
  24. Endoh Kenji (Iruma JPX) Narui Fumio (Tokyo JPX) Sugiyama Kazuhiro (Tokyo JPX) Hara Kazuya (Tokyo JPX) Shimazaki Tatsuo (Tokyo JPX), Method of manufacturing a small electronic device.
  25. Parmentier Paul (Cailly-sur-Eure FRX), Method of manufacturing an identification card and an identification manufactured, for example, by this method.
  26. Kambara Kenji,JPX, Method of sealing electronic parts with a resin.
  27. Pflughaupt,L. Elliott; Gibson,David; Kim,Young Gon; Mitchell,Craig S.; Zohni,Wael; Mohammed,Ilyas, Microelectronic assembly having array including passive elements and interconnects.
  28. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Multi-layer identification card.
  29. Takahira Kenichi,JPX ; Ohbuchi Jun,JPX ; Murasawa Yasuhiro,JPX, Non-contact type IC card.
  30. , Process and apparatus for authenticating the signature of a signed message.
  31. Remi Brechignac FR, Smart card and process for manufacturing the same.
  32. Pflughaupt, L. Elliott; Gibson, David; Kim, Young-Gon; Mitchell, Craig S., Stacked packages.
  33. Pflughaupt, L. Elliott; Gibson, David; Kim, Young-Gon; Mitchell, Craig S.; Zohni, Wael; Mohammed, Ilyas, Stacked packages.
  34. Ferber,Andrew R.; Kaiserman,Terrance Z.; Gentile,John; Gentile,Anthony; Bravo,Juan, System for securing personal cards.
  35. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
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