초록 ▼

A circuit package has an inverted receptacle-like housing with a base plate and a depending peripheral wall. Upper and lower substrates are spaced within the housing with the major elements including lead frame elements and thick film conductor circuits on the facing surfaces. The upper substrate, t

A circuit package has an inverted receptacle-like housing with a base plate and a depending peripheral wall. Upper and lower substrates are spaced within the housing with the major elements including lead frame elements and thick film conductor circuits on the facing surfaces. The upper substrate, typically containing control circuitry, is mounted along the under side of the base plate while the lower substrate, typically containing power circuitry, closes the receptacle and forms a heat sink for the circuit package. Lead frame extensions within power input and output circuitry project from the lower substrate and protrude through openings within the upper surface of the base plate. In addition, lead frame extensions within the control circuitry on the first substrate likewise protrude through the base plate openings. In certain instances, lead frame extensions from both of the substrates are commonly located in the same opening and operatively provide electrical coupling between the two substrates. In certain instances, terminal plugs are removeably connected to one or more lead frame extensions located within said base plate openings for external electrical connections.

대표청구항 ▼

A circuit package comprising: a housing having a base plate surrounded by a peripheral wall to form a circuit receiving receptacle; a first substrate positioned in said receptacle with one side adjacent the interior side of said base plate and the other side containing electrical circuitry, said sub

A circuit package comprising: a housing having a base plate surrounded by a peripheral wall to form a circuit receiving receptacle; a first substrate positioned in said receptacle with one side adjacent the interior side of said base plate and the other side containing electrical circuitry, said substrate having a first set of electrical leads comprising sheet-like lead frame extensions extending from said substrate; a second substrate positioned in said receptacle adjacent the rim of said peripheral wall and closing the receptacle of said housing, said second substrate being spaced from said first substrate in said housing and having circuitry on the side facing said first substrate, said second substrate having a second set of leads comprising sheet-like lead frame extensions extending from said substrate; and a plurality of recessed cells in said base plate extending through said base plate and opening on the exterior side thereof, selected leads of said first and second sets positioned within and surrounded by selected ones of said recessed cells to engage external connector means inserted in said cells for interconnection within external electrical circuits.