초록 ▼

The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed between the treated surfaces of the substrate and base. Pressure is applied to cause the layer of resin to c

The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed between the treated surfaces of the substrate and base. Pressure is applied to cause the layer of resin to conform to irregularities in the two surfaces. This forms a heat transfer path between the substrate and base. It is particularly effective for heat transfer in a vacuum. Pressure on the conforming resin is maintained by rigid, releasable mechanical fasteners which hold the substrate to the base. Where good electrical conduction between the substrate and base is required in addition to good heat transfer, the resin is one of the electrically conductive types such as those filled with a powdered metal. Nondestructive removal of the substrate is accomplished by releasing the mechanical fasteners.

대표청구항 ▼

A method of mounting a substrate for microelectronic circuitry on a base wherein a releasable attachment is formed between an attachment surface of said substrate and a related attachment surface of said base, wherein said attachment surfaces of said substrate and of said base are of electrically co

A method of mounting a substrate for microelectronic circuitry on a base wherein a releasable attachment is formed between an attachment surface of said substrate and a related attachment surface of said base, wherein said attachment surfaces of said substrate and of said base are of electrically conductive material, said method comprising: treating at least one of said attachment surfaces with a surface modifier to form a film of a fluoropolymer release agent maintained on said at least one of said attachment surfaces wherein said film is thick enough to have anti-sticking properties but no thicker than about 1000 angstroms; disposing a layer of an adhesive, catalytically polymerizable, and conformable material filled with an electrically conductive material between said substrate and base attachment surfaces; and applying opposing forces to said substrate and said base in a manner which applies pressure to said conformable material and causes said conformable material to flow into and fill voids and irregularities in said attachment surfaces, thereby mating said attachment surfaces to each other for relatively high thermal conductivity and relatively low electrical resistance between said surfaces.