초록 ▼

A method of continuously manufacturing honeycomb sandwiches is provided wherein skin panels of various materials may be more easily and effectively adhered to the honeycomb core. Thermoplastic adhesives which soften at temperatures above the laminate thermosetting temperature are used to provide fir

A method of continuously manufacturing honeycomb sandwiches is provided wherein skin panels of various materials may be more easily and effectively adhered to the honeycomb core. Thermoplastic adhesives which soften at temperatures above the laminate thermosetting temperature are used to provide firm bonding. Bondline voids, therefore, become less frequent and more easily repairable.

대표청구항 ▼

A continuous method of producing a honeycomb sandwich assembly comprising: layering a sheet of thermoplastic adhesive upon a honeycomb core; setting a layer of thermosetting laminae upon said adhesive sheet as to form an unbonded assembly consisting of said honeycomb core, said adhesive sheet and sa

A continuous method of producing a honeycomb sandwich assembly comprising: layering a sheet of thermoplastic adhesive upon a honeycomb core; setting a layer of thermosetting laminae upon said adhesive sheet as to form an unbonded assembly consisting of said honeycomb core, said adhesive sheet and said laminae layer; locally evacuating the space about the unbonded assembly; heating the unbonded assembly in a pressurized oven to the laminate curing temperature while supporting said layer of laminae upon said thermoplastic sheet; maintaining laminate curing temperature and pressure levels until the laminate is substantially cured; increasing the temperature while decreasing the pressure level within the pressurized oven until the assembly reaches thermoplastic softening temperature and bonding pressure levels; compressing said softened thermoplastic layer as to form a bond between said honeycomb core and said laminate; decreasing the temperature below the thermoplastic softening level and post-curing the bonded assembly; and slowly cooling the bonded assembly to room temperature.