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Integrated circuit temperature gradient and moisture regulator 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-029/00
  • F28F-027/00
  • H01L-023/02
  • H02B-001/00
출원번호 US-0947280 (1978-09-29)
발명자 / 주소
  • Swiatosz Edmund (Maitland FL)
출원인 / 주소
  • United States of America as represented by the Secretary of the Navy (Washington DC 06)
인용정보 피인용 횟수 : 37  인용 특허 : 3

초록

An improved temperature gradient and moisture regulator for electrically powered apparatus and the like is disclosed as comprising an insulated mount for supporting the apparatus whose temperature gradient and moisture is to be controlled. A thermoelectric cooler is located in effective contact with

대표청구항

An apparatus temperature and moisture regulator, comprising in combination: an apparatus whose temperature and moisture is to be regulated; means effectively connected to said apparatus for the effective packaging thereof in such manner as to effect the support thereof and thermally isolate it from

이 특허에 인용된 특허 (3)

  1. Beriger Conrad (Aarau CH) Keller Eduard (Wettingen CH), Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium.
  2. Ahmann Gerald L. (St. Paul MN) Carlson Douglas M. (Anoka MN) Marquardt Warren B. (Stillwater MN) Offerdahl Richard E. (Shoreview MN) Paulson Roger A. (New Brighton MN) Vacca Anthony A. (New Brighton , Circuit packaging and cooling.
  3. Koopman Nicholas George (Hopewell Junction NY) Totta Paul Anthony (Poughkeepsie NY), Method of making conduction-cooled circuit package.

이 특허를 인용한 특허 (37)

  1. Novotny, Shlomo; Dunn, John; Vogel, Marlin, Active temperature gradient reducer.
  2. Anderton Richard L. (West Jordan UT) Curtis Steven E. (Salt Lake City UT), Apparatus for cooling charge coupled device imaging systems.
  3. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  4. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  5. Adelbert M. Gillen, Compact thermoelectric cooling system.
  6. Adelbert M. Gillen, Compact thermoelectric cooling system.
  7. Scott, Alexander Robin Walter, Computer cooling apparatus.
  8. Scott, Alexander Robin Walter, Computer cooling apparatus.
  9. Scott,Alexander Robin Walter, Computer cooling apparatus.
  10. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  11. Vandersande Ian W. ; Ewell Richard ; Fleurial Jean-Pierre ; Lyon Hylan B., Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices.
  12. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
  13. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  14. Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH), Localized cooling apparatus for cooling integrated circuit devices.
  15. Bhatia Rakesh ; Padilla Robert D. ; Hermerding ; II James G., Method and apparatus for cooling integrated circuits using a thermoelectric module.
  16. Porter Warren W. (Escondido CA) Lauffer Donald K. (San Diego CA), Method and apparatus for low temperature integrated circuit chip testing and operation.
  17. Rennies Jos,BEX ; Noels Barts,BEX, Method and apparatus for temperature-controlled testing of integrated circuits.
  18. Yu, Min-Hui; Lin, Chi-Feng; Chen, Chin-Ming, Method for manufacturing two-phase heat exchange device.
  19. Nordman,Eric S.; Ozawa,Miho; Kojima,Masaya; Inaba,Ryoji; Kodama,Yoshitaka; Yamazaki,Motohiro, Multi-capillary electrophoresis apparatus.
  20. Ana Tabuenca Garcia ES, Packaging system for fragile merchandise.
  21. Parise, Ronald J., Quick charge battery with thermal management.
  22. Hines Edward E. (Palm Bay FL) Royer Lee J. (Satellite Beach FL) Jehring Thomas D. (Palm Bay FL) Faulkenberry William E. (Palm Bay FL) Posey Norvan J. (Palm Bay FL) Richeson Joseph T. (Melbourne FL), RF transparent thermal test chamber.
  23. Demand Erhart E. (Boston MA), Rotatable inspection table.
  24. Gower Roger ; Kingery John ; Guthrie J. Cameron ; Frost Kevin ; Miller Steve ; Uekert Ken, Semiconductor thermal conditioning apparatus and method.
  25. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  26. Kim, Tae-Yong, System for controlling temperature of a secondary battery module.
  27. Yip,Tsunwai Gary; Nguyen,David, System for controlling the temperature of electronic devices.
  28. Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
  29. Duchatelet Roland,BEX ; Hiligsmann Vincent,BEX ; Diels Roger,BEX, Temperature control system.
  30. Roland Duchatelet BE; Vincent Hiligsmann BE; Roger Diels BE, Temperature control system.
  31. Yokota Yuji (Iwate JPX), Thermal printer temperature regulation system.
  32. Quarre, Steven C., Thermally efficient CCD camera housing.
  33. Quarre,Steven C., Thermally efficient CCD camera housing.
  34. Perchak Robert M. (Dayton OH), Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing.
  35. Nakayama Kazuaki,JPX, Thermoelectric cooling system.
  36. Yamada, Kazukiyo; Tashiro, Kohei; Esaki, Hidenori; Kudou, Tomohide, Thermoelectric module.
  37. Yamada Kazukiyo,JPX ; Ito Syohei,JPX, Thermoelectric module unit.
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