초록 ▼

A method of making and the resulting heat exchanger in which there is provided a header plate having a tube receiving opening closely embracing the tube in the opening with a sheet of solder on at least one of the tube and plate adjacent to the opening together with a retainer wettable by the molten

A method of making and the resulting heat exchanger in which there is provided a header plate having a tube receiving opening closely embracing the tube in the opening with a sheet of solder on at least one of the tube and plate adjacent to the opening together with a retainer wettable by the molten solder attached to the tube and plate and bearing against the solder to retain it in position. The assembly of tube, plate, retainer and solder is heated to a melting temperature for the solder with the result that the molten solder flows over the wettable retainer and into the space between the plate and tube by capillary attraction after which the solder is cooled to a solidifying temperature to form a solder joint uniting the tube and header.

대표청구항 ▼

The method of joining a heat exchanger tube to a header plate, comprising: providing a header plate having a tube receiving opening in said plate closely embracing said tube when inserted in said opening; arranging a said heat exchanger tube in said opening; providing a sheet of solder on at least o

The method of joining a heat exchanger tube to a header plate, comprising: providing a header plate having a tube receiving opening in said plate closely embracing said tube when inserted in said opening; arranging a said heat exchanger tube in said opening; providing a sheet of solder on at least one of said tube and plate adjacent to said opening; attaching a retainer wettable by molten said solder to said tube or plate and bearing against said solder to retain it in position, said solder having a melting point less than the melting point of the header, tube and retainer; heating the resulting assembly of tube, plate, retainer and solder to a melting temperature for said solder whereby said molten solder flows over said retainer and into the space between the plate and tube by capillary attraction; and cooling the solder to a temperature less than the melting point of the solder to form a joint uniting said tube and header, said retainer being provided with an opening surrounding said tube, the opening being defined by a sharp edge engaging and slightly penetrating the surface of the tube for holding the retainer in position.