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Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03C-001/68
출원번호 US-0060276 (1979-07-25)
발명자 / 주소
  • Bennett Richard E. (Hudson WI) Hittner Mary A. (Little Canada MN)
출원인 / 주소
  • Minnesota Mining and Manufacturing Company (St. Paul MN 02)
인용정보 피인용 횟수 : 29  인용 특허 : 14

초록

“Release on demand”pressure-sensitive adhesives and tapes which are readily detackifiable by exposure to actinic radiation. The adhesive system has an oxirane ring-bearing component blended thereinto (or preferably reacted therewith) to achieve an adhesive epoxy equivalent value of 400-900, preferab

대표청구항

Normally tacky and pressure-sensitive adhesive having an epoxy equivalent value of about 400-900 and including an effective amount of ionic photoinitiator selected from the group consisting of radiation-sensitive aromatic onium salts of Group Va or VIa; onium catalysts of Group Va, VI or VIIa, diary

이 특허에 인용된 특허 (14)

  1. Smith George H. (Maplewood MN) Olofson Peter M. (North St. Paul MN), Complex salt photoinitiator.
  2. Crivello ; James V., Curable compositions and method for curing such compositions.
  3. Green ; George E., Epoxide resins.
  4. Crivello James V. (Elnora NY), Method for making certain halonium salt photoinitiators.
  5. Schlesinger Sheldon I. (East Windsor Township ; Mercer County NJ) Cochran Veronica (Armonk NY), Method of polymerizing a copolymer of glycidyl methacrylate and allyl glycidyl ether.
  6. Crivello James V. (Elnora NY) Schroeter Siegfried H. (Schenectady NY), Photocurable compositions and methods.
  7. Crivello James V. (Elnora NY), Photocurable compositions containing group via aromatic onium salts.
  8. Crivello ; James V., Photocurable epoxy compositions containing group Va onium salts.
  9. Tsao Jung-Hsien (Columbia MD) Ketley Arthur D. (Columbia MD), Photocurable epoxy-acrylate compositions.
  10. Crivello ; James V., Photographic method.
  11. Barton ; Robert W., Photohardenable compositions.
  12. Shipley John F. (Endicott NY), Photosensitive coating composition and use thereof.
  13. Pastor ; Stephen D. ; Grover ; Martin M., Pressure sensitive adhesive compositions.
  14. Mowdood Syed K. (Akron OH) Given David A. (Cuyahoga Falls OH), Pressure sensitive adhesives using interpolymer of acrylates, oxypropyl acrylamides and acrylic acid.

이 특허를 인용한 특허 (29)

  1. Stebbings, William L.; Landgrebe, Kevin D.; Perry, Dale C., Adhesive detackification.
  2. Stebbings,William L.; Landgrebe,Kevin D.; Perry,Dale C., Adhesive detackification.
  3. Webster Iain,GBX, Adhesives.
  4. Weikel, Arlin L.; Gaddam, Babu N.; Krepski, Larry R.; Mahoney, Wayne S.; Clapper, Jason D., Adhesives comprising epoxy-acid crosslinked groups and methods.
  5. Chung, Kevin Kwong-Tai, Carrier tape.
  6. Cabernoch, James L.; White, Leonard A., Container such as a nursing container, with flexible liner and access site and method of making said access site.
  7. Cummings ; deceased Paul M. ; Soltysiak John R. ; Beland Dale C. ; Heeb Myron C. ; Bingaman Grant J., De-tackified continuous extrusion process applied integrated label product.
  8. Cummings Paul M. ; Soltysiak John R. ; Beland Dale C. ; Heeb Myron C. ; Bingaman Grant J., De-tackified labels extrusion process applied integrated label product.
  9. Bennett Richard E. (Hudson WI) Flatt Donald V. (Hudson WI), Dry transfer article.
  10. Ginkel Scott T. (Stillwater MN) Falaas Dennis O. (Stillwater MN), Graphic composite with thermally detackifiable adhesive premask tape.
  11. Jin, Xiaoming; Hammesfahr, Paul D., Low stress flowable dental compositions.
  12. Husemann,Marc; Z?llner,Stephan; W?rden,Kai Tom, Method for cross-linking polyacrylates.
  13. Kuroda Hideo (Hannancho JPX) Taniguchi Masao (Sennan JPX), Method for dicing a semiconductor wafer.
  14. Williams, Kevin Alan; Eagan, Robert Lee; Templeton, Lisa Kay; McConnell, Richard Leon, Modified carboxylated polyolefins and their use as adhesion promoters.
  15. Eagan, Robert Lee; Williams, Kevin Alan; Cheek, Allen Morgan, Modified chlorinated carboxylated polyolefins and their use as adhesion promoters.
  16. Jin, Xiaoming D; Hammesfahr, Paul D, Photopolymerizable and photocleavable resins and low shrink and low stress composite compositions.
  17. Gaud, Vincent; Gnanou, Yves; Desvergne, Jean Pierre; Dieras, Francis; Roubiere, Alexandrine, Photosensitive adhesive composition.
  18. Weikel, Arlin L.; Krepski, Larry R.; Clapper, Jason D.; Mahoney, Wayne S.; Gaddam, Babu N., Pressure-sensitive adhesives with onium-epoxy crosslinking system.
  19. Smialowicz Edward H. (Pt. Pleasant NJ), Radiant heat reflective inflatable structure.
  20. Miller David D. (Bricktown NJ), Radiant heat reflective inflatable structure and methods for making same.
  21. Chung,Kevin Kwong Tai, Re-usable carrier structure.
  22. Charbonneau Robert R. (Lake Elmo MN) Groff Gaylord L. (North St. Paul MN), Storable, crosslinkable pressure-sensitive adhesive tape.
  23. Groff Gaylord L. (St. Paul MN), Storable, crosslinkable pressure-sensitive adhesive tape.
  24. Kinzer Kevin E. (Woodbury MN) Holland Lowell W. (St. Paul Park MN) Sridhar Krishnamurthy (Austin TX) Kellen James N. (Austin TX) Pribnow Richard W. (Austin TX), Substrate coated or impregnated with flexible epoxy composition.
  25. Tunius, Mats, Switchable adhesives.
  26. Uemura Gosei (Osaka JPX) Satoda Yoshinari (Osaka JPX) Shigemura Eiji (Osaka JPX), Thin adhesive sheet for working semiconductor wafers.
  27. Williams, Kevin Alan; Bellas, Michael; Freeman, Jr., Charlie Carroll; Templeton, Lisa Kay, UV-curable, non-chlorinated adhesion promoters.
  28. Williams,Kevin Alan; Bellas,Michael; Freeman, Jr.,Charlie Carroll; Templeton,Lisa Kay, UV-curable, non-chlorinated adhesion promoters.
  29. Dickinson, Peter; Ellwood, Michael, Water-based photopolymerizable compositions and their use.
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