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[미국특허] Low shock transmissive antechamber seal mechanisms for vacuum chamber type semi-conductor wafer electron beam writing ap 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-013/08
출원번호 US-0219657 (1980-12-24)
발명자 / 주소
  • Mack Alfred (Poughkeepsie NY) O\Neill Brian C. (Millbrook NY) Penzetta Fred L. (Wappingers Falls NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 53  인용 특허 : 2

초록

An electron beam vacuum chamber is provided with an elevator mechanism within the chamber including a platform closing off an opening within a horizontal vacuum chamber wall and separating the vacuum chamber from an overlying antechamber partially defined by a vertically displaceable lid overlying t

대표청구항

In an electron beam writing system for beam writing on work pieces, said system including: an electron beam vacuum chamber having internally a beam writing area, an access opening within said vacuum chamber to one side of the beam writing area, movable means mounted to said vacuum chamber for moveme

이 특허에 인용된 특허 (2) 인용/피인용 타임라인 분석

  1. Wittkower Andrew B. (Rockport MA) Ryding Geoffrey (Manchester MA), Isolation lock for workpieces.
  2. Hassan Javathu K. (Hopewell Junction NY) Mack Alfred (Poughkeepsie NY) Wojtaszek Michael R. (Poughkeepsie NY), Method and apparatus for handling workpieces.

이 특허를 인용한 특허 (53) 인용/피인용 타임라인 분석

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Walde Michael (Rodenbach DEX) Zejda Jaroslav (Rodenbach DEX), Apparatus for passing workpieces into and out of a coating chamber through locks.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Kroeker Tony R. ; Cook Larry, Atmospheric wafer transfer module with nest for wafer transport robot.
  6. Boyd Trace L. ; Beer Richard D. ; Terbeek Eric A. ; Wong Vernon W. H., Chamber interfacing O-rings and method for implementing same.
  7. Boyd Trace L. ; Beer Richard D. ; Terbeek Eric A. ; Wong Vernon W. H., Chamber interfacing O-rings and method for implementing same.
  8. Kroeker,Tony R., Cluster tool process chamber having integrated high pressure and vacuum chambers.
  9. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  10. Kroeker Tony R. ; Mooring Benjamin W. ; Bright Nicolas J., Dual sided slot valve and method for implementing the same.
  11. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  12. Jones, William D., High pressure fourier transform infrared cell.
  13. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  14. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Toro-Lira Guillermo L., High speed in-vacuum flat panel display handler.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson, Horizontal sputtering system.
  19. Robert B Farmer ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Heiko D. Moritz, Inverted pressure vessel with shielded closure mechanism.
  20. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  21. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  23. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  24. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  25. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  26. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  27. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  28. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  29. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  30. Kroeker, Tony R.; Tomasch, Gregory A., Methods of implementing a single shaft, dual cradle vacuum slot valve.
  31. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  32. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  33. Wuester,Christopher D., Process flow thermocouple.
  34. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  35. Mooring Benjamin W. ; Bright Nicolas J., Semiconductor processing platform architecture having processing module isolation capabilities.
  36. Harada Hiroshi (Tokyo JPX) Iwasawa Yoshiyuki (Tokyo JPX) Ishida Tsutomu (Tokyo JPX) Kobayashi Shintaro (Tokyo JPX), Semiconductor processing system.
  37. Kroeker, Tony R.; Tomasch, Gregory A., Single shaft, dual cradle vacuum slot valve.
  38. Idris, Fadzli B.; Purushothman, Ganesen, Sputter chamber pressure gauge with vibration absorber.
  39. Chandra, Mohan; Mount, David J.; Costantini, Michael A.; Moritz, Heiko D.; Jafri, Ijaz; Boyd, Jim; Heathwaite, Rick M., Supercritical fluid cleaning process for precision surfaces.
  40. Heiko D Moritz ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Ijaz Jafri, Supercritical fluid drying system and method of use.
  41. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  42. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  43. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson, System and method for transporting and sputter coating a substrate in a sputter deposition system.
  44. Larson Dean Jay ; Sutton Thomas R., Tolerance resistant and vacuum compliant door hinge with open-assist feature.
  45. Boyd Trace L. ; Terbeek Eric A., Transport chamber and method for making same.
  46. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  47. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  48. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  49. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  50. Boyd Trace L. (San Jose CA) Yeoman Martin F. (San Ramon CA), Vacuum chamber gate valve and method for making same.
  51. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  52. Mirkovich Ninko T. (Novato CA) Zajac John (San Jose CA), Vacuum load lock apparatus.
  53. Kloss,Ingo, Workpiece feeder device for an electron beam processing device.

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