초록 ▼

Concentrated sunlight impinges on a large area photovoltaic device which is bonded to a highly pliable and thermally and electrically conductive structured copper strain relieving member; the lower face of the structured copper is sealed to a fluid cooled metal heat sink. Large power densities of su

Concentrated sunlight impinges on a large area photovoltaic device which is bonded to a highly pliable and thermally and electrically conductive structured copper strain relieving member; the lower face of the structured copper is sealed to a fluid cooled metal heat sink. Large power densities of sunlight are absorbed without appreciable temperature rise. The structured copper accommodates to the difference in expansion between the metal heat sink and the semiconductor wafer. Three embodiments utilize a single planar junction diode, an interdigitated diode, and series connected isolated junction diodes.

대표청구항 ▼

A fluid cooled photovoltaic device which converts concentrated sunlight into electrical energy comprising: a semiconductor wafer in the lower face of which is formed an interdigitated solar cell having alternating fingers of p-type and n-type semiconductor on each of which is a metallization, one se

A fluid cooled photovoltaic device which converts concentrated sunlight into electrical energy comprising: a semiconductor wafer in the lower face of which is formed an interdigitated solar cell having alternating fingers of p-type and n-type semiconductor on each of which is a metallization, one set of semiconductor fingers and metallizations being elevated above the other set of fingers and metallizations; a fluid cooled metal heat sink; device leads connected to the metallizations on said one set of elevated semiconductor fingers and to said metal heat sink; a structured copper strain relieving member having one surface bonded to the metallizations on said other set of semiconductor fingers and the opposing surface bonded to said metal heat sink; said structured copper member being comprised of substantially parallel closely packed strands of copper approximately equal length, and highly thermally and electrically conductive and pliable so as to accommodate to the difference in expansion between said metal heat sink and semiconductor wafer.