초록 ▼

A solar cell is provided which has a front electrode which wraps around the edge of the cell and onto a portion of the back of the cell. A second electrode is also provided on the back of the cell thereby permitting all electrical connections to be made on one side of the cell. A method for making s

A solar cell is provided which has a front electrode which wraps around the edge of the cell and onto a portion of the back of the cell. A second electrode is also provided on the back of the cell thereby permitting all electrical connections to be made on one side of the cell. A method for making such a cell also is disclosed.

대표청구항 ▼

A method of making a solar cell with a wrap-around electrode whereby said cell has electrodes on the back surface thereof comprising: providing a back-to-back assembly of two semiconductor bodies of one conductivity type separated by a chemically inert spacer having substantially the same geometry,

A method of making a solar cell with a wrap-around electrode whereby said cell has electrodes on the back surface thereof comprising: providing a back-to-back assembly of two semiconductor bodies of one conductivity type separated by a chemically inert spacer having substantially the same geometry, but of smaller dimensions as said semiconductor body; treating said assembly with a dopant material whereby a surface layer of opposite conductivity type is deposited over the entire surface of said semiconductor bodies, around the edges thereof and in a strip around the perimeter of the back surface of said semiconductor body; abrading the back surface of said semiconductor body to define a junction between the bulk portion of said semiconductor body and said surface layer; forming a grid and first electrode pattern on said surface layer, said first electrode pattern extending in a strip along at least a portion of the perimeter of the top surface of said semiconductor, around the edge thereof and in a strip along at least a portion of the perimeter of the back surface of said cell; forming a second electrode pattern on the back of said semiconductor body and in contact with the bulk portion thereof, said second electrode pattern separated by an area having at the surface thereof said junction between said surface layer and said bulk portion; and metallizing said patterns.