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Coaxial cable design 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01B-007/26
출원번호 US-0318653 (1981-11-05)
발명자 / 주소
  • O\Loughlin James P. (Albuquerque NM)
출원인 / 주소
  • The United States of America as represented by the Secretary of the Air Force (Washington DC 06)
인용정보 피인용 횟수 : 57  인용 특허 : 1

초록

It has been discovered that the transient voltage which develops on the outer sheath of a coaxial cable under pulse voltage excitation is a result of the inequality between the self inductance of the sheath and the mutual inductance between the sheath and the center conductor. The self inductance of

대표청구항

In a coaxial cable having a center conductor, an outer conductive sheath surrounding said center conductor, a dielectric material between said center conductor and said outer sheath, and said outer sheath and said center conductor each having an inductance, the improvement therein comprising means i

이 특허에 인용된 특허 (1)

  1. Cookson ; Alan H., Gas insulated transmission line having low inductance intercalated sheath.

이 특허를 인용한 특허 (57)

  1. Dunklee, John, Chuck for holding a device under test.
  2. Dunklee, John, Chuck for holding a device under test.
  3. Dunklee, John, Chuck for holding a device under test.
  4. Dunklee,John, Chuck for holding a device under test.
  5. Dunklee,John, Chuck for holding a device under test.
  6. Dunklee,John, Chuck for holding a device under test.
  7. Stewart, Craig; Lord, Anthony; Spencer, Jeff; Burcham, Terry; McCann, Peter; Jones, Rod; Dunklee, John; Lesher, Tim; Newton, David, Chuck for holding a device under test.
  8. Stewart,Craig; Lord,Anthony; Spencer,Jeff; Burcham,Terry; McCann,Peter; Jones,Rod; Dunklee,John; Lesher,Tim; Newton,David, Chuck for holding a device under test.
  9. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  10. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  11. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  12. Yokoi, Kiyonori; Mori, Akinori; Endo, Seiji; Yamamoto, Akira, Coaxial cables, multicore cables, and electronic apparatuses using such cables.
  13. Yokoi,Kiyonori; Mori,Akinori; Endo,Seiji; Yamamoto,Akira, Coaxial cables, multicore cables, and electronic apparatuses using such cables.
  14. Perlman Daniel (Arlington MA), Electric heating elements free of electromagnetic fields.
  15. Root, Bryan J.; Funk, William A., Electrical, high temperature test probe with conductive driven guard.
  16. Root, Bryan J.; Funk, William A., Electrical, high temperature test probe with conductive driven guard.
  17. Root,Bryan J.; Funk,William A., Electrical, high temperature test probe with conductive driven guard.
  18. Atalar Ergin ; Ocali Ogan, Enhanced safety coaxial cables.
  19. Dunklee, John; Norgden, Greg; Cowan, C. Eugene, Guarded tub enclosure.
  20. Dunklee,John; Norgden,Greg; Cowan,C. Eugene, Guarded tub enclosure.
  21. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  22. McFadden,Bruce, Localizing a temperature of a device for testing.
  23. Harris,Daniel L.; McCann,Peter R., Optical testing device.
  24. Nordgren, Greg; Dunklee, John, Probe station.
  25. Nordgren, Greg; Dunklee, John, Probe station.
  26. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  27. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  28. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  29. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  30. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  31. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  32. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  33. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  34. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  35. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  36. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  37. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  38. Navratil,Peter; Froemke,Brad; Stewart,Craig; Lord,Anthony; Spencer,Jeff; Runbaugh,Scott; Fisher,Gavin; McCann,Pete; Jones,Rod, Probe station with two platens.
  39. Lesher, Timothy E., Probe testing structure.
  40. Lesher,Timothy E., Probe testing structure.
  41. Root, Bryan J., Probe tile for probing semiconductor wafer.
  42. Root,Bryan J., Probe tile for probing semiconductor wafer.
  43. Root, Bryan J.; Funk, William A., Replaceable probe apparatus for probing semiconductor wafer.
  44. Root, Bryan J.; Funk, William A., Replaceable probe apparatus for probing semiconductor wafer.
  45. Dunklee,John, Switched suspended conductor and connection.
  46. Dunklee,John, Switched suspended conductor and connection.
  47. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  48. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  49. Andrews, Peter; Hess, David, System for testing semiconductors.
  50. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  51. Rumbaugh,Scott, Thermal optical chuck.
  52. Rumbaugh,Scott, Thermal optical chuck.
  53. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station having a skirting component.
  54. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  55. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  56. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  57. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
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