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Positional reference system for ultraprecision machining 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-015/46
  • G01B-011/02
출원번호 US-0186869 (1980-09-12)
발명자 / 주소
  • Arnold Jones B. (Knoxville TN) Burleson Robert R. (Clinton TN) Pardue Robert M. (Knoxville TN)
출원인 / 주소
  • The United States of America as represented by the United States Department of Energy (Washington DC 06)
인용정보 피인용 횟수 : 45  인용 특허 : 1

초록

A stable positional reference system for use in improving the cutting tool-to-part contour position in numerical controlled-multiaxis metal turning machines is provided. The reference system employs a plurality of interferometers referenced to orthogonally disposed metering bars which are substantia

대표청구항

In an automatic controlled machining system including a spindle, means for rotating said spindle, a cutting tool holder for holding a cutting tool, a cross slide means for moving the cutting tool holder reversably along an x axis and an axial slide means for moving one of the spindle and the cross s

이 특허에 인용된 특허 (1)

  1. Barkman William E. (Oak Ridge TN), Linear motor drive system for continuous-path closed-loop position control of an object.

이 특허를 인용한 특허 (45)

  1. Lo Ying-Ching (Fremont CA) Escorcio Tolentino (San Leandro CA) Zambre Samuel (Palo Alto CA) Singh Ajeet (Berkeley CA), Analog drive for ultrasonic probe with tunable phase angle.
  2. Harold Newell ; John Wiggins, Apparatus and method for automatically compensating for lateral runout.
  3. Eran Dvir IL; Moshe Finarov IL; Eli Haimovich IL; Beniamin Shulman IL, Apparatus for optical inspection of wafers during polishing.
  4. Finarov, Moshe, Apparatus for optical inspection of wafers during polishing.
  5. Finarov,Moshe, Apparatus for optical inspection of wafers during processing.
  6. Johnstone Richard (Brookfield WI) Kirkham Edward E. (Brookfield WI) Chung Han C. (West Allis WI) Ostby Lyle D. (Milwaukee WI), Automatic dynamic error compensator.
  7. Dahlquist, Håkan, Chucking fixture with device for measuring the distance between a chunk and a toolholder or workholder.
  8. Nakaoki Touru (Tokyo JPX) Uno Hiroshi (Tokyo JPX), Digital measuring device.
  9. Rhyner Hans-Ulrich (Dbendorf CHX), Displacement detecting system in a multi-axis measuring system, especially for use with a gear wheel grinding or inspect.
  10. Palleiko Benjamin (Stoughton MA), Fixture and nonrepeatable error compensation system.
  11. Lo Ying-Ching (Fremont) Zambre Samuel (Palo Alto) Escorcio Tolentino (San Leandro CA), Linear power control for ultrasonic probe with tuned reactance.
  12. Spriggs Robert G. (St. Petersburg FL), Method and apparatus adapted for automatic or semi-automatic fabrication of ultra-precision opthalmic lenses, e.g., cont.
  13. Logan David J. (Glastonbury CT) Rich Leonard G. (West Hartford CT), Method and apparatus for making prescription eyeglass lenses.
  14. Holmes Terry L. (DeForest WI) Skaar Gary R. (Marshall WI) Gundlach Larry C. (Madison WI) Flisram Dennis G. (Plainfield WI), Method and apparatus for off-line honing of slicer blades.
  15. Gerdes, Michael D.; Olsen, Michael A.; Colarelli, III, Nicholas J.; Wise, Matt; Friton, Gerry E., Method and apparatus for resurfacing brake rotors.
  16. Inaba Hajimu (Hino JPX) Sakakibara Shinsuke (Kunitachi JPX), Method and apparatus for robot control.
  17. Johns Antony (Guiseley GB2), Method and apparatus for the measurement of airfoils.
  18. Middleton Christohper O. (Capitola CA) Robson Colin L. (San Jose CA), Method for automatic position control of a tool.
  19. Greenwood, Thomas A.; Pastusak, Thomas W., Method for improving the accuracy of machines.
  20. Ballough Douglas M. (Issaquah WA) Higginbotham Howard L. (Renton WA), Method for machining three dimensional contours utilizing a numerically controlled lathe.
  21. Nakamura Masahiro (Tokyo JPX), Method for oscillating ultrasonic waves and a microcomputer\s built-in ultrasonic wave oscillator circuitry.
  22. Nakaya Tadao (Utsunomiya JPX) Ide Shinji (Shimizu JPX), Method of measuring by coordinate measuring instrument.
  23. Iwano Hideo (Kawasaki JPX), Method of measuring by coordinate measuring instrument and coordinate measuring instrument.
  24. Parker Merle A. (Columbia SC) Ahmed Hassan J. (Columbia SC), Nuclear fuel rod straightness measuring system and method.
  25. Inaba Hajimu (Hino JPX) Ono Yukio (Yokohama JPX) Hiraizumi Mitsuo (Hachioji JPX), Numerical control method and apparatus.
  26. Bieg, Lothar F.; Jokiel, Jr., Bernhard; Ensz, Mark T.; Watson, Robert D., Position feedback control system.
  27. Pasciak Robert L. (Decatur TX), Positioning device and method.
  28. Nagayama Kazuhiko (Kanagawa JPX) Masuda Masami (Yokohama JPX) Maeda Yukio (Yokohama JPX), Precision positioning device.
  29. Wirz, Walter, Setting up process for a tool or workpiece on a gear making machine.
  30. Greenwood, Thomas A.; Pastusak, Thomas W., Software for improving the accuracy of machines.
  31. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  32. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  33. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  34. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  35. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  36. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  37. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  38. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  39. Sandhu, Gurtej S.; Doan, Trung Tri, System for real-time control of semiconductor wafer polishing.
  40. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including heater.
  41. Sandhu Gurtej S. (Boise ID) Doan Trung Tri (Boise ID), System for real-time control of semiconductor wafer polishing including optical monitoring.
  42. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including optical montoring.
  43. Slocum Alexander H. (McLean VA) Thurston Debra (McLean VA), System to provide high speed, high accuracy motion.
  44. Keller, David; Brocato, Brett, Systems and methods for machining materials.
  45. Heynacher, Erich; Ludewig, Reinhard, Three-dimensional interferometric length-measuring apparatus.
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