초록 ▼

A circuit card having the capability for the high-density packaging of electronic components thereon for use in high power-density card racks in computer and other electronic and avionic systems. The card has an all metal construction with an elongated planar body portion for the mounting of electro

A circuit card having the capability for the high-density packaging of electronic components thereon for use in high power-density card racks in computer and other electronic and avionic systems. The card has an all metal construction with an elongated planar body portion for the mounting of electronic components on the opposite sides thereof and has a heat pipe located along the edges of one elongated side and the two ends. A connector for making the required electrical connections to the electronic components is provided along the edge of the second elongated side. Edge tabs on the ends of the card permit the card to be installed into a card rack in electronic equipment. The elongated portion of the heat pipe serves as the evaporator region thereof and the two end portions act as the condensing regions. In operation, heat from the components on the card is conducted into the evaporator region of the heat pipe and is transferred to the condensing region thereof where it passes by conduction into the cooling system of the card rack.

대표청구항 ▼

An electronic component mounting module for use in a rack associated with electronic systems, said rack having frame members provided with guide rails receiving said electronic module, said frame members having cooling means therein, the improvement comprising: an elongated metallic circuit card hav

An electronic component mounting module for use in a rack associated with electronic systems, said rack having frame members provided with guide rails receiving said electronic module, said frame members having cooling means therein, the improvement comprising: an elongated metallic circuit card having first and second longitudinal sides and first and second ends, said circuit card having a solid substantially planar thermally conductive body mounting a plurality of electronic components on the opposite surfaces thereof; a heat pipe integral with and in thermal contact with said body and extending along the edge of said first longitudinal side and said first and second ends, said heat pipe having a hermetically sealed casing having an uninterrupted vapor flow passage extending the full extent of said heat pipe, said casing being evacuated of air, capillary pumping means in said casing, and in a working fluid contained in a liquid state in said capillary pumping means and a vapor state in said flow passage for the transfer of heat; an electrical connector extending along said second longitudinal side of said card and establishing electrical communication with said electronic components mounted on said card; elongated coplanar upstanding tabs on said heat pipe and extending from said heat pipe at said ends of said card, said tabs fitting into said guide rails in said frame members in said rack such that said card is installed in said rack for operation therein, wherein the longitudinal section of said heat pipe serves as the evaporator region and the end sections serve as the condenser regions whereby the heat generated by the operation of said electronic components is conducted through said card body and passes into said heat pipe longitudinal section, evaporating said liquid in said capillary means, the vapor therefrom transferring said heat to the condenser section of said heat pipe where said heat is conducted through said tabs for dissipation therefrom.