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Surface inspection scanning system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0262866 (1981-05-12)
발명자 / 주소
  • Alford W. Jerry (Charlotte NC) Cushing Charles J. (Charlotte NC) Hunt James D. (Charlotte NC) Smith Michael L. (Matthews NC) Vander Neut Richard D. (Charlotte NC) Wilkes James L. (Matthews NC)
출원인 / 주소
  • Aeronca Electronics, Inc. (Pineville NC 02)
인용정보 피인용 횟수 : 43  인용 특허 : 8

초록

A system for laser scanning a relatively movable reflective surface element and inspecting that surface by monitoring the reflected energy in both light and dark channel receivers. Flaws occurring on the surface of the element, depending on the types of flaws, cause various frequency components to b

대표청구항

A flaw inspection system comprising: means defining an inspection surface; means for repeatedly scanning a narrow beam of electromagnetic radiation along a line across said defined inspection surface; means for transporting a reflective surface element to be inspected at a predetermined speed along

이 특허에 인용된 특허 (8)

  1. Hudson Kenneth C. (Philadelphia PA), Defect detection and plotting system.
  2. Clarke Graham M. (Edinburgh GB6) Bedford John (Gorebridge GB6), Discrimination circuit arrangements.
  3. Araseki Takashi (Tokyo JA) Ochiai Kazuo (Tokyo JA), Maximum value tracing circuit for digitized voice signals.
  4. Takasuka ; Kaoru ; Takahashi ; Masatatsu ; Nishimura ; Sadaji, Non-woven fabric defect detecting device.
  5. Piovoso Michael J. (Newark DE) Smith ; Jr. Edmund H. (Wilmington DE) Wolf William E. (Newark DE), On-line web inspection system.
  6. Faulhaber Mark E. (Wilmington DE) Smith ; Jr. Edmund H. (Wilmington DE), Optical-electrical web inspection system.
  7. Holly Sandor (Falls Church VA), Process and apparatus for sensing defects on a smooth surface.
  8. Wolf William E. (Newark DE), Web inspection system and method therefor.

이 특허를 인용한 특허 (43)

  1. Schemmel, Floyd; Thorne, Richard, Apparatus and method for automatically detecting defects on silicon dies on silicon wafers.
  2. Curl, Barry J., Apparatus for determining with high resolution the position of edges of a web.
  3. O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  4. O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  5. O'Dell, Jeffrey; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
  6. Moran Kevin E. (Belmont NC), Compact laser scanning system.
  7. Hartog, Arthur; Kadar, Kamal, Controlling a dynamic signal range in an optical time domain reflectometry.
  8. Brunfeld Andrei,ILX ; Shamir Joseph,ILX ; Toker Gregory,ILX ; Singher Liviu,ILX ; Laver Ilan,ILX ; Pekel Ely,ILX, High speed optical inspection apparatus for a large transparent flat panel using gaussian distribution analysis and method therefor.
  9. Brunfeld Andrei,ILX ; Shamir Joseph,ILX ; Toker Gregory,ILX ; Singher Liviu,ILX ; Laver Ilan,ILX ; Pekel Ely,ILX, High speed optical inspection apparatus for a transparent disk using gaussian distribution analysis and method therefor.
  10. Brunfeld Andrei,ILX ; Shamir Joseph,ILX ; Toker Gregory,ILX ; Singher Liviu,ILX ; Laver Ilan,ILX ; Pekel Ely,ILX, High speed optical inspection apparatus using Gaussian distribution analysis and method therefore.
  11. Brunfeld Andrei,ILX ; Shamir Joseph,ILX ; Toker Gregory,ILX ; Singher Liviu,ILX ; Laver Ilan,ILX ; Pekel Ely,ILX, High speed surface inspection optical apparatus for a reflective disk using gaussian distribution analysis and method therefor.
  12. Lisa R. Zeimantz, Integrated circuit defect review and classification process.
  13. Lisa R. Zeimantz, Integrated circuit defect review and classification process.
  14. Zeimantz Lisa R., Integrated circuit defect review and classification process.
  15. Zeimantz Lisa R., Integrated circuit defect review and classification process.
  16. Zeimantz, Lisa R., Integrated circuit defect review and classification process.
  17. Phan, Khoi A.; Singh, Bhanwar; Rangarajan, Bharath, Low defect metrology approach on clean track using integrated metrology.
  18. Cook Robert F. ; Liniger Eric G. ; Mendelson Ronald L. ; Sanders Dean R., Mechanical strength die sorting.
  19. Morioka, Hiroshi; Noguchi, Minori; Ohshima, Yoshimasa; Kembo, Yukio; Nishiyama, Hidetoshi; Matsuoka, Kazuhiko; Shigyo, Yoshiharu, Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process.
  20. Morioka,Hiroshi; Noguchi,Minori; Ohshima,Yoshimasa; Kembo,Yukio; Nishiyama,Hidetoshi; Matsuoka,Kazuhiko; Shigyo,Yoshiharu, Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process.
  21. Morioka Hiroshi (Ebina JPX) Noguchi Minori (Yokohama JPX) Ohshima Yoshimasa (Yokohama JPX) Kembo Yukio (Yokohama JPX) Taniguchi Yuzo (Higashimurayama JPX), Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line.
  22. Moran Kevin E. (Belmont NC) Smith Michael L. (Matthews NC) Lippard ; III Ernest R. (Charlotte NC), Method and apparatus for inspecting reticles.
  23. Saha, Nilay; Pen, Hermen Folken, Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process.
  24. Germer Thomas A. ; Asmail Clara C., Microroughness-blind optical scattering instrument.
  25. Bronte Joseph J. (Poughkeepsie NY) Herbert Roland C. (Hopewell Junction NY) Khoury Henri A. (Yorktown Heights NY), Optical inspection system for semiconductor wafers.
  26. Schauer,Ronald Vern, Optical measurement apparatus.
  27. Leslie, Brian C.; Nikoonahad, Mehrdad; Wells, Keith B., Optical scanning system for surface inspection.
  28. Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
  29. Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
  30. Hackney, Joshua J.; Malek, Arye; Ulrich, Franz W.; Estridge, John B., Parts manipulation, inspection, and replacement system and method.
  31. Nikoonahad, Mehrdad; Stokowski, Stanley E., Scanning system for inspecting anamolies on surfaces.
  32. Nikoonahad,Mehrdad; Stokowski,Stanley E., Scanning system for inspecting anomalies on surfaces.
  33. Wajer Mark Thomas ; Witkowski Joseph T. ; Smith David M., Stabilized pressure-hydrated magnesium hydroxide slurry from burnt magnesite and process for its production.
  34. Witkowski Joseph T. (Baltimore MD) Smith David M. (Kearneysville WV) Wajer Mark T. (Baltimore MD), Stabilized, pressure-hydrated magnesium hydroxide slurry from burnt magnesite and process for its production.
  35. Ogawa Shigeru (Yokohama JPX) Yamaji Hiroshi (Chigasaka JPX) Kano Masaaki (Kamakura JPX), Surface defect inspecting apparatus.
  36. G. Neil Haven ; Myron Czubko, Surface defect inspection system and method.
  37. Sekine Akihiko,JPX, Surface detecting apparatus.
  38. Hajime Yoshida (Tokyo JPX), Surface inspection apparatus using a mask system to monitor uneven surfaces.
  39. Sun,Xueqing; Eyolfson,Mark; Langworthy,Chris; Major,Karl L., System and method for analyzing electrical failure data.
  40. Koshinaka Masao (Hyogo JPX) Akiyama Minoru (Hyogo JPX) Tanaka Hitoshi (Hyogo JPX) Tomoda Toshimasa (Hyogo JPX), System for detecting minute particles on or above a substrate.
  41. Simmons Steven J., Yield based, in-line defect sampling method.
  42. Simmons, Steven J., Yield based, in-line defect sampling method.
  43. Simmons, Steven J., Yield based, in-line defect sampling method.
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