$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Panels for holding printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47F-005/00
출원번호 US-0236616 (1981-02-20)
발명자 / 주소
  • Welsch, John H.
출원인 / 주소
  • Metropolitan Wire Corporation
대리인 / 주소
    Goodman & Teitelbaum
인용정보 피인용 횟수 : 31  인용 특허 : 3

초록

Panels for holding printed circuit boards and the like which includes at least a pair of panels, each panel having a front surface with raised portions thereon to provide a criss-cross arrangement of recesses for receiving edges of the printed circuit boards therein, the recesses extending at inclin

대표청구항

1. Panels for holding printed circuit boards in a cart and the like, comprising: at least a pair of panels; each panel including side edges and a front surface disposed between said side edges; said front surfaces having raised portions to provide recess means for receiving edges of the printed

이 특허에 인용된 특허 (3)

  1. Van Osdol ; Peter, Circuit board storage cart.
  2. Morris Royden B. (940 11th Ave. SW. Calgary ; Alberta CAX), Microfiche tray.
  3. Thomas Theodore C. (Ellicott City MD), Tote box for carrying different length circuit boards.

이 특허를 인용한 특허 (31)

  1. King Douglas A. (1602 W. 51st N. Wichita KS 67204) Nelson Ryan (8472 Lakeland Ct. Wichita KS 67207), Apparatus and method for storing compact disc jewel boxes.
  2. Drexler, Rudolph A., Apparatus for the mounting and wiring of printed circuit boards.
  3. Matsuda Akehiro,JPX ; Ohno Haruhiko,JPX, Cassette case for holding substrates therein.
  4. Matsuda Akehiro,JPX ; Ohno Haruhiko,JPX, Cassette case for holding substrates therein.
  5. Moxon Edwin C. (Boxboro MA), Chassis for electronic circuitry.
  6. Gendernalik Robert A. (2747 Union Ave. San Jose CA 95124), Circuit board storage apparatus.
  7. Reimer, William A., Double file printed wiring board module.
  8. Jan, Jong Rong; Lu, Tsai Hua; Chiu, Sao Ling; Kung, Ling Chen, Electronic devices including offset conductive bumps.
  9. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers.
  10. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive shunt layers.
  11. Rinne,Glenn A.; Nair,Krishna K., Low temperature methods of bonding components and related structures.
  12. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Methods of forming electronic structures including conductive shunt layers and related structures.
  13. Nair,Krishna K.; Rinne,Glenn A.; Batchelor,William E., Methods of forming electronic structures including conductive shunt layers and related structures.
  14. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Methods of forming lead free solder bumps.
  15. Rinne, Glenn A., Methods of forming metal layers using multi-layer lift-off patterns.
  16. Mis,J. Daniel, Methods of forming solder bumps on exposed metal pads.
  17. Rinne,Glenn A., Methods of providing solder structures for out plane connections.
  18. Jan,Jong Rong; Lu,Tsai Hua; Chiu,Sao Ling; Kung,Ling Chen, Methods of selectively bumping integrated circuit substrates and related structures.
  19. Rinne Glenn A. ; Deane Philip A., Microelectronic packaging using arched solder columns.
  20. Batchelor, William E.; Rinne, Glenn A., Non-Circular via holes for bumping pads and related structures.
  21. Rinne,Glenn A., Optical structures including liquid bumps and related methods.
  22. Reimer William A. (Wheaton IL), Printed wiring board file and method of utilizing the same.
  23. Nam, Tae-Duk; Kim, Jin-Ho; Kim, Hyuk-Su; Kim, Hyoung-Suk; Lee, Tae-Young, Semiconductor package having supporting plate and method of forming the same.
  24. Nam, Tae-Duk; Kim, Jin-Ho; Kim, Hyuk-Su; Kim, Hyoung-Suk; Lee, Tae-Young, Semiconductor package having supporting plate and method of forming the same.
  25. Rinne, Glenn A., Solder structures for out of plane connections.
  26. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Solder structures including barrier layers with nickel and/or copper.
  27. Rinne,Glenn A., Stacked electronic structures including offset substrates.
  28. Kryter Karl D. (P.O. Box 750 Bodega Bay CA 94923), Storage case for magnetic tape cassettes, their boxes and the like.
  29. Belanger ; Jr. Thomas D. (Clarendon Hills IL), Substrate mounting device.
  30. Belanger ; Jr. Thomas D. (Clarendon Hills IL), Substrate mounting device.
  31. Seefeldt Roger L. (Oklahoma City OK), Universal circuit pack container.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로