초록 ▼

A method is provided for rapidly and thoroughly curing a heat curable adhesive substance by application of radiation heat energy without excessive temperature elevation of the adhesive substance. The method comprises the controlled application of radiation heat energy to the adhesive substance for e

A method is provided for rapidly and thoroughly curing a heat curable adhesive substance by application of radiation heat energy without excessive temperature elevation of the adhesive substance. The method comprises the controlled application of radiation heat energy to the adhesive substance for elevating the exposed surface of the adhesive substance to a predetermined maximum temperature level. The radiation heat energy is then alternately removed from the adhesive substance to allow the exposed surface to cool partially, and resupplied to the adhesive substance to reheat the exposed surface to the predetermined maximum temperature level. This alternating controlled application of the radiation heat energy produces a thermal oscillation within the adhesive substance resulting in a rapid temperature rise and corresponding rapid cure time of portions of the adhesive substance not directly exposed to the radiation heat energy.

대표청구항 ▼

A method of curing a heat curable substance, comprising the steps of: positioning a heat sensor adjacent an exposed surface of the substance for responding to radiation heat energy to generate a signal representative of the temperature level of the exposed surface of the substance; irradiating the e

A method of curing a heat curable substance, comprising the steps of: positioning a heat sensor adjacent an exposed surface of the substance for responding to radiation heat energy to generate a signal representative of the temperature level of the exposed surface of the substance; irradiating the exposed surface of the substance and the heat sensor with radiation heat energy; removing the radiation heat energy from the substance and the heat sensor in response to the heat sensor signal when the signal is representative of the exposed surface reaching a predetermined maximum temperature level; allowing the exposed surface of the substance to cool to a predetermined lower temperature level; reapplying the radiation heat energy in response to the heat sensor signal when the signal is representative of the exposed surface of the substance reaching the predetermined lower temperature level to reheat the exposed surface to the predetermined maximum temperature level; and repeating said removing and said reapplying steps in sequence until the surface of the substance opposite the exposed surface is cured.