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Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A44B-021/00
  • F16L-035/00
  • H02B-001/04
출원번호 US-0229795 (1981-01-30)
발명자 / 주소
  • Goiffon John J. (Grapevine TX) Thawley S. Tom (Dallas TX)
출원인 / 주소
  • Tele-Drill Inc, (Richardson TX 02)
인용정보 피인용 횟수 : 37  인용 특허 : 3

초록

A heat sink/retainer clip (54) capable of resiliently holding objects, such as printed circuit boards, in tubular members, such as telemetering tools. The heat sink/retainer clip comprises two portions (56, 60) which extend across the tube from opposite sides thereof and two portions (58, 62) which

대표청구항

A heat sink/retaining clip for resiliently retaining a first object within a second object having a circular cross-section, said clip comprising: a first portion dimensional to extend at least partially across the circular cross-section of the second object from a first point located interiorly of t

이 특허에 인용된 특허 (3)

  1. Rein Charles R. (Panama City FL), Electronic card mount and heat transfer assembly for underwater vehicles.
  2. Kraft Robert W. (Indianapolis IN), Flexible printed circuit board assembly.
  3. Chippel Bob M. (Toronto CAX), Frame assembly for electronic components.

이 특허를 인용한 특허 (37)

  1. Kuckes Arthur F. (Ithaca NY), Apparatus for locating an elongated conductive body by electromagnetic measurement while drilling.
  2. Sheffield, Rick, Apparatus for securing printed circuit boards.
  3. Russell Michael K. (Prestbury CA GB2) Wesenberg Donald L. (Santa Barbara CA) Leaney Peter A. (Charlton Kings GB2), Assemblies for supporting electrical circuit boards within tubes.
  4. Russell Michael K. (Prestbury GB2) Wesenberg Donald L. (Northleach GB2) Leaney Peter A. (Cheltenham GB2), Assemblies for supporting electrical circuit boards within tubes and method of using same.
  5. Goss Steven R. (Tucson AZ) Taggart Owen H. (Tucson AZ), Circuit card mounting system having a cylindrical housing and circular card locks.
  6. Storm, Bruce H; Chen, Dingding; Song, Haoshi, Cooling apparatus, systems, and methods.
  7. Goodman, George David; Epstein, Robert Eric; Wittig, J. Michael, Downhole electronic assemblies.
  8. Bitller Jean-Pierre (Plaisir FRX) Faucher Pascal (Longjumeau FRX) Hang-Hu Monique (Sainte Genevieve des Bois FRX) Pelet Andr (Maurepas FRX), Electronic circuit housing.
  9. White Billy W. (Duncan OK), Exoskeletal packaging scheme for circuit boards.
  10. Smith, Jeffrey M.; Garretson, Blake T.; Rapp, Jeremy A.; White, Matthew R., Fixture for supporting a sensing device on a movable article.
  11. Peter, Andreas, Heat dissipater for electronic components in downhole tools and methods for using the same.
  12. Garnier, Florence; Auchere, Jean-Christophe; Guelat, Alain, Heat dissipation in downhole equipment.
  13. Jeffries John ; Wang Ray, Heat dissipator with multiple thermal cooling paths.
  14. Lakin Bryan L. (Springfield MO) McDaniel William P. W. (Springfield MO), Heat sink and mounting arrangement therefor.
  15. Azar Kaveh, Heat sink with arc shaped fins.
  16. Storm, Jr., Bruce H.; Schultz, Roger L.; Fripp, Michael L., Heating and cooling electrical components in a downhole operation.
  17. Sharp, Stanley O., High density electronics packaging system for hostile environment.
  18. Lafuente, Marta; Pineau, Francois; Roussie, Gabriel, Holding device insertable into the central bore of a tubular drill string component, and corresponding tubular drill string component.
  19. Pearson Donald R., Inductor system for a submersible pumping system.
  20. Sanderlin, Kerry L.; Riche, Jr., Jimmie L.; DiFoggio, Rocco; Bahadur, Vaibhav, Method and apparatus of heat dissipaters for electronic components in downhole tools.
  21. Guyenot, Michael; Geissler, Alexander, Method and device for fastening a planar substrate, having an electric circuit or the like, in a mounting position.
  22. Glovatsky, Andrew Z.; Stoica, Vladimir, Microelectronic package with tubular housing.
  23. Glovatsky,Andrew Z.; Stoica,Vladimir, Microelectronic package within cylindrical housing.
  24. Logan, Aaron W.; Liu, Jili (Jerry); Switzer, David A; Logan, Justin C., Mounting and component holder apparatuses and assemblies for holding rigid components.
  25. Knight, Sean Paul, Mounting plate apparatus, systems, and methods.
  26. Haubold, Carsten; Peter, Andreas; Schimanski, Michell; Preiser, Christian, Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies.
  27. McKee Gary F. ; Saveliev Mike ; Cooper David J., Pump driven by brushless motor.
  28. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Rechargeable energy storage device in a downhole operation.
  29. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  30. Sinclair, Paul L.; Neves, Robert Scott, Shock mounted sensor package with thermal isolation.
  31. Martinez, Ruben; Diaz, Adan, Shock tolerant heat dissipating electronics package.
  32. Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
  33. Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
  34. Hoover C. G. (Fort Worth TX), Spring-biased heat sink.
  35. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Switchable power allocation in a downhole operation.
  36. Lee, Tsung-Chi, Tube.
  37. Gunawardana,Ruvinda; Arzoumanidis,G. Alexis, Vortex tube cooling system.
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