초록 ▼

A hermetic seal is formed without expensive precious metals by fusing two members of a semiconductor package together by scanning a laser beam along adjacent edges of the members. The compositions of the members which are fused together include ceramic, glass and metal. The method enables the format

A hermetic seal is formed without expensive precious metals by fusing two members of a semiconductor package together by scanning a laser beam along adjacent edges of the members. The compositions of the members which are fused together include ceramic, glass and metal. The method enables the formation of a hermetic seal at a relatively low temperature thereby greatly reducing the thermal stress on the semiconductor chip with resulting improvement in yields.

대표청구항 ▼

A method of hermetically sealing a semiconductor chip within a package comprising: providing a first ceramic member having a plurality of conductive paths hermetically sealed therein; providing a plurality of electrically conductive leads for making external connections to the conductive paths; bond

A method of hermetically sealing a semiconductor chip within a package comprising: providing a first ceramic member having a plurality of conductive paths hermetically sealed therein; providing a plurality of electrically conductive leads for making external connections to the conductive paths; bonding a semiconductor chip to a surface of the first ceramic member; forming electrical connections between regions of the semiconductor chip and the conductive paths; providing a second ceramic member in abutting relationship with portions of the first ceramic member so as to define a compartment therebetween in which the semiconductor chip resides; and exposing adjacent edges of the first and second ceramic members to a laser beam for a sufficient duration to fuse the adjacent edges together throughout a closed loop so as to hermetically seal the compartment from the surrounding atmosphere.