초록 ▼

Disclosed is a two-stage thermoelectric heat pumping apparatus for heating/cooling an I.C. chip. The first stage is a primary thermoelectric module sandwiched between a base made of a high thermal conductivity material and functioning as a heat source/sink and a heat conductive pad. The second stage

Disclosed is a two-stage thermoelectric heat pumping apparatus for heating/cooling an I.C. chip. The first stage is a primary thermoelectric module sandwiched between a base made of a high thermal conductivity material and functioning as a heat source/sink and a heat conductive pad. The second stage is a secondary thermoelectric module sandwiched between the pad and a heat conductive block designed to receive a slotted I.C. chip socket at the top portion thereof and provided with a contact surface such that, upon insertion into the socket, the chip is in direct contact with said contact surface. By passing suitable currents through all the thermoelectric modules heat is pumped, in the heating mode, from the base (source) to the chip and, in the cooling mode, from the chip to the base (sink).

대표청구항 ▼

An apparatus for selectively heating and cooling an I.C. chip comprising: a base formed of high thermal conductivity material and having a cavity for mounting the I.C. chip inside the cavity and selectively acting as one of a heat source or a heat sink, said cavity having a flat floor; a pair of pri

An apparatus for selectively heating and cooling an I.C. chip comprising: a base formed of high thermal conductivity material and having a cavity for mounting the I.C. chip inside the cavity and selectively acting as one of a heat source or a heat sink, said cavity having a flat floor; a pair of primary thermoelectric modules having upper and lower faceplates, said lower faceplates being in thermal contact with said cavity floor; a heat conductive pad having upper and lower surfaces, the lower surface of said pad being in thermal contact with the upper faceplates of said primary thermoelectric modules; a secondary thermoelectric module having upper and lower faceplates, the lower faceplate of said secondary module being in thermal contact with the upper surface of said heat conductive pad; a heat conductive block having a base in thermal contact with the upper faceplate of said secondary thermoelectric module and an upwardly extending portion having a contact surface; and a slotted I.C. chip socket in integral relationship with the upwardly extending portion of said block such that, upon insertion into said socket, the chip is in thermal contact with said contact surface of the block.