초록 ▼

This invention is directed to applying thermal barrier coating systems to hardware having passageways in the walls connecting apertures in the surface to a gas supply for film cooling. An inert gas, such as argon, is discharged through the apertures during the application of the thermal barrier coat

This invention is directed to applying thermal barrier coating systems to hardware having passageways in the walls connecting apertures in the surface to a gas supply for film cooling. An inert gas, such as argon, is discharged through the apertures during the application of the thermal barrier coating system by plasma spraying. This flow of inert gas reduces both blocking of the holes and base metal oxidation during the coating operation.

대표청구항 ▼

A method of applying a thermal barrier coating system to a member having a plurality of passages therein extending from a surface thereof to a plenum chamber to accommodate an outward flow of fluid to provide film cooling in a high temperature environment comprising the steps of supplying a fluid un

A method of applying a thermal barrier coating system to a member having a plurality of passages therein extending from a surface thereof to a plenum chamber to accommodate an outward flow of fluid to provide film cooling in a high temperature environment comprising the steps of supplying a fluid under pressure to said plenum chamber whereby said fluid flows outward through said passages, plasma spraying a metal bond coat onto said surface having the passages therein while said fluid flows through said passages, and depositing a thermal barrier coating material on said metal bond coat while said fluid flows through said passages whereby entry of said coating material into said passages is prevented thereby inhibiting blockage thereof and reducing base metal oxidation.