초록 ▼

In a process for laminating a photosensitive layer to a aluminum or copper substrate surface by means of nip rolls, the improvement comprising the sequential steps of: (a) rendering the substrate surface clean, as defined by the uniform water film test; (b) within about 1 minute after rendering the

In a process for laminating a photosensitive layer to a aluminum or copper substrate surface by means of nip rolls, the improvement comprising the sequential steps of: (a) rendering the substrate surface clean, as defined by the uniform water film test; (b) within about 1 minute after rendering the substrate clean and immediately prior to lamination, applying a thin layer of liquid to form an interface between the substrate surface and the photosensitive layer; (c) displacing the thin layer of liquid from the interface by absorption into the photosensitive layer during lamination, and (d) within 30 seconds after lamination, removing the support for the photosensitive layer without delamination of the photosensitive layer from the substrate by bending the support back along a longitudinal axis of the photosensitive layer.

대표청구항 ▼

In a process for laminating by means of pressure a strippable film supported photosensitive layer to a cleaned nonporous substrate surface consisting essentially of copper or aluminum, the improvement comprising the sequential steps of: (a) rendering the copper or aluminum substrate surface clean, t

In a process for laminating by means of pressure a strippable film supported photosensitive layer to a cleaned nonporous substrate surface consisting essentially of copper or aluminum, the improvement comprising the sequential steps of: (a) rendering the copper or aluminum substrate surface clean, the cleanliness of the surface being defined by the uniform water film test; (b) within about 1 minute after rendering the substrate surface clean and immediately prior to lamination, applying a thin layer of liquid to form an interface between the substrate surface and the photosensitive layer; (c) displacing the thin layer of liquid from the interface by absorption into the photosensitive layer during lamination; and (d) within 30 seconds after lamination, removing the support for the photosensitive layer without delamination of the photosensitive layer from the substrate by bending the support back along a longitudinal axis of the photosensitive layer.