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Surface defects in a cured, molded thermoset fiberglass reinforced (FRP) part can be repaired by filling the defect or void with an excess of a thermosetting conductive repair material, applying pressure and heat sufficient to cure said material without substantial shrinkage of said material, removi

Surface defects in a cured, molded thermoset fiberglass reinforced (FRP) part can be repaired by filling the defect or void with an excess of a thermosetting conductive repair material, applying pressure and heat sufficient to cure said material without substantial shrinkage of said material, removing the pressure, cooling and finishing said parts to the original surface contour.

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A method for repairing a surface defect in a thermoset fiberglass reinforced polyester resin or vinyl ester resin molding comprising (I) filling said defect with an excess amount of a thermosetting electrically conductive repair material, (II) applying to said repair material heat at a temperature o

A method for repairing a surface defect in a thermoset fiberglass reinforced polyester resin or vinyl ester resin molding comprising (I) filling said defect with an excess amount of a thermosetting electrically conductive repair material, (II) applying to said repair material heat at a temperature of from about 280°F. to 415°F. and pressure at from about 25 to 50 psi, or from about 36 to 50 psi, for a period of time sufficient to cure said repair material without substantial shrinkage, (III) withdrawing the heat and pressure from the part and allowing the part to cool to room temperature and (IV) finishing said part in the area of said defect to remove excess repair material and to return the part to its original contour, said repair material consisting essentially of (a) a polymerizable epoxy based oligomer having at least two acrylate groups in an amount of 100 parts by weight, (b) a copolymerizable ethylenically unsaturated monomer in an amount of from about 80 to 150 parts by weight, (c) a zinc salt of a fatty acid having at least 10 carbon atoms in an amount of from about 0.2 to 5 parts by weight, (d) an accelerator for an organic free radical peroxide initiator in an amount of from about 0.05 to 2 parts by weight, (e) polyvinyl acetate in an amount of from about 30 to 80 parts by weight, (f) a copolymerizable monoethylenically unsaturated compound having a －CO－group and a －NH2, －NH－and/or －OH group in an amount of from about 20 to 120 parts by weight, (g) a copolymerizable liquid acrylate compound having from 2 to 4 vinyl groups, being free of urethane, cycloaliphatic and aromatic groups and having an average molecular weight of up to about 1500 in an amount of from about 20 to 120 parts by weight, (h) a calcium salt of a fatty acid having at least 10 carbon atoms in an amount of from about 0.2 to 5 parts by weight, (i) an inorganic filler in an amount of from about 50 to 150 parts by weight, (j) a conductive carbon black in an amount of from about 5 to 20 parts by weight and (k) an organic free radical peroxide initiator in an amount of up to about 5%, or up to about 2%, by weight based on the weight of said ethylenically unsaturated materials, said polymerizable and copolymerizable materials (a), (b), (f) and (g) being different from each other.