초록 ▼

Method and apparatus for the front surface metallization and encapsulation of solar cells of the type comprising p and n semiconductor strata separated by a barrier junction, and front and rear conducting strata constituting electrical contacts, wherein the front conducting stratum is a novel metall

Method and apparatus for the front surface metallization and encapsulation of solar cells of the type comprising p and n semiconductor strata separated by a barrier junction, and front and rear conducting strata constituting electrical contacts, wherein the front conducting stratum is a novel metallic grid permitting transmission of solar radiation to the semiconductor strata. This metallic grid is in the form of a mesh of wires of sufficiently high tensile strength to be self-supporting while being drawn from spools or the like into contact with one or more components of the solar cell before completion of the cell\s fabrication. The method is characterized in that the metallic grid, in the form of the mesh of wires, is encapsulated between a transparent cover plate and the exposed front surface of the semiconductor strata, the mesh forming an electrical contact with the front surface of the semiconductor strata simultaneously that the plate is electrostatically bonded thereto. The apparatus is preferably automated and conveyorized.

대표청구항 ▼

Apparatus for the front surface metallization and encapsulation of solar cells comprising: (a) means for forming a single dimensional mesh of metallic wires with a conductive bus and for depositing a transparent plate onto said mesh of metallic wires; (b) means for bringing a front surface of a semi

Apparatus for the front surface metallization and encapsulation of solar cells comprising: (a) means for forming a single dimensional mesh of metallic wires with a conductive bus and for depositing a transparent plate onto said mesh of metallic wires; (b) means for bringing a front surface of a semiconductor wafer into contact with said plate and said mesh of metallic wires thereon; (c) means for electrostatically bonding said transparent plate to said semiconductor wafer, with said mesh of metallic wires encapsulated therebetween; and (d) means for pressing said transparent plate to said semiconductor wafer while effecting said electrostatic bonding therebetween. Apparatus for the front surface metallization and encapsulation of solar cells comprising: (a) means for forming a single-dimensional mesh of metallic wires with a conductive bus and for depositing a transparent plate onto said mesh of metallic wires; (b) means for heating said plate and for pressing said mesh of metallic wires into a softened surface of said plate; (c) means for bringing a front surface of semiconductor wafer into contact with said surface of said plate and said mesh of metallic wires embedded therein; (d) means for electrostatically bonding said plate surface to said front surface of said semiconductor wafer, with said mesh of metallic wires encapsulated therebetween; and (e) means for pressing said plate surface to said front surface of said semiconductor wafer while effecting said electrostatic bonding therebetween.