초록 ▼

A process for extending and fixing conductors to circuit board base surfaces between pre-established spaced points in straight paths and pre-established spaced points in inflected paths, the steps comprising, fixing the end of the conductor to a pad at the first of a pair of pre-selected points and,

A process for extending and fixing conductors to circuit board base surfaces between pre-established spaced points in straight paths and pre-established spaced points in inflected paths, the steps comprising, fixing the end of the conductor to a pad at the first of a pair of pre-selected points and, while feeding the conductor with a guide, moving the board and the guide relative to each other along a straight path to a pad at the second of the pair of pre-established points or to a pad at an inflection point, if the conductor is to be inflected, and then to said second pad. Severing said conductor at said second pad and affixing the conductor end to said second pad. Repeating the foregoing steps until the conductor has been affixed to the pre-established pairs of pads and to the pads at the inflection points. After all of the pre-established spaced points have been interconnected with conductors either in straight or inflected paths, affixing the conductors to the board blank surface with a adhesive by applying pressure to the conductor pattern.

대표청구항 ▼

1. A process for extending and fixing continuous conductors between pre-established pairs of contact points on a board base surface along straight paths between selected of said pairs and along inflected paths between selected other of said pairs, the steps comprising: (a) providing a board base

1. A process for extending and fixing continuous conductors between pre-established pairs of contact points on a board base surface along straight paths between selected of said pairs and along inflected paths between selected other of said pairs, the steps comprising: (a) providing a board base having pads affixed to the board surface at pre-established contact points and points where conductor inflections are to be formed and mounting said board base on a table movable relative to a conductor feed guide, with the surface of said board base having said pads facing said guide; (b) engaging the end of the conductor to be extended and fixed to said board surface with the pad at the first of a pair of pre-established contact points on said board surface and affixing said end to said first pad; (c) with said end affixed to said first pad and where said conductor is to be extended and fixed to said board surface between a pair of contact points in a straight path, while feeding said conductor with said guide, moving said board base and said guide in a straight path relative to each other and extending said conductor from said pad at the first of said pair of contact points to the pad at the second of said pair of contact points, severing said conductor and engaging and affixing the severed end of said conductor to said pad at said second contact point; (d) with said end affixed to said pad at said first of a pair of contact points and where said conductor is to be extended and fixed to said board surface between the pair of contact points in an inflected path, while feeding said conductor with said guide, moving said board base and said guide in a straight path relative to each other in a first direction and extending said conductor from said first of said pair of contact points to the pad at the point in such path where said conductor is to be inflected and affixing said conductor at said inflection point to said pad at said inflection point on said board surface, inflecting said board base and said guide relative to each other and moving said board base and said guide in a straight path relative to each other in a second direction and extending said conductor to the pad at the next following inflection point where there is to be more that one inflection in the path, affixing the conductor at the pad at each such inflection point, inflecting said board base and said guide relative to each other and moving said board base and said guide in a straight path relative to each other in a third direction and extending said conductor through inflection points, as aforesaid, until the pad at the second of said pair of pre-established contact points is reached, severing said conductor at said pad at said second contact point and engaging and affixing the severed end of said conductor to said pad at said second contact point; (e) each time said conductor is severed and the severed end has been affixed to the pad at the second of the pair of contact points, moving said board and said guide relative to each other to engage the end of said conductor with the pad at the first of the next pair of pre-established contact points and repeating said steps until conductors have been scribed between the pads of all of the pre-established pairs of contact points; and (f) after all of said conductors have been extended and affixed to said pairs of contact points on said board base to be connected, removing said board base from said table and affixing said conductors along their lengths intermediate said pads to said board base surface. 2. A process, as recited in claim 1, in which said conductor is affixed to said board blank surface with an adhesive and said adhesive is activated while pressure is applied to said conductor pattern on said board blank surface. 3. A process, as recited in claim 2, in which said board blank surface is coated with said activatable adhesive as said continuous conductor is applied thereon. 4. A process, as recited in claim 2, in which said continuous conductor is pre-coated with said activatable adhesive before said continuous conductor is extended on said board blank surface. 5. A process, as recited in claim 2, in which said activatable adhesive is applied to said continuous conductor as said conductor is being applied to said board. 6. A process, as recited in claim 2, in which said activatable adhesive is applied to the surface of said board blank between said surface and said conductor as said conductor is being applied to said board. 7. A process, as recited in claim 2, in which said activatable adhesive is applied to said board blank and to said continuous conductor pattern after said continuous conductor is extended and applied thereon and before said conductor pattern is affixed to said board blank. 8. A process, as recited in claim 2, 3, 4, 5, 6, or 7, in which said activatable adhesive is heat responsive. 9. A process, as recited in claim 2, 3, 4, 5, 6, or 7, in which said activatable adhesive is solvent responsive. 10. A process, as recited in claim 2, 3, 4, 5, 6, or 7, in which said activatable adhesive is heat responsive and heat is applied to said board and said heat responsive adhesive from an external source while pressure is being applied to said conductor pattern. 11. A process, as recited in claim 2, 3, 4, 5, 6, or 7, in which said activatable adhesive is heat responsive and heat is applied to said board and said heat responsive adhesive by electrical means. 12. A process, as recited in claim 1, in which said pads at said inflection points are adhesive pads and said conductor is affixed to said surface at said inflection points by said adhesive pads. 13. A process, as recited in claim 1, in which said conductor ends are affixed to said pairs of contact points and said conductor is fixed to inflection points intermediate said ends with an adhesive applied to said conductor as said conductor is fed to said board base by said guide. 14. A process, as recited in claim 1, or 13, in which said adhesive is continuously applied to said conductor as said conductor is fed to said board base. 15. A process, as recited in claim 1, wherein said conductor is affixed to said board base surface intermediate said contact points. 16. A process, as recited in claim 15, in which said conductor is affixed to said board base surface continuously. 17. A process, as recited in claim 1, in which said pads at said inflection points are metal pads.