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Process and bath for electroplating nickel-chromium alloys 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-003/56
  • C25D-005/14
출원번호 US-0567451 (1983-12-30)
발명자 / 주소
  • Lashmore David S. (Frederick MD)
출원인 / 주소
  • The United States of America as represented by the Secretary of Commerce (Washington DC 06)
인용정보 피인용 횟수 : 32  인용 특허 : 2

초록

A process for the electrodeposition of a nickel chromium alloy on a cathodic substrate comprises: contacting the substrate with an aqueous electrolyte containing: about 50-125 g/l of CrCl3.6H2O; about 10-125 g/l of NiCl2.6H2O; about 10-115 g/l of formic acid; about 25-50 g/l of boric acid; and about

대표청구항

A process for the electrodeposition of a nickel-chromium alloy on a cathodic substrate, comprising: contacting the substrate with an aqueous electrolyte containing: about 50-125 g/l of CrCl3.6H2O; about 10-125 g/l of NiCl2.6H2O; about 10-115 g/l of formic acid; about 25-50 g/l of boric acid; and abo

이 특허에 인용된 특허 (2)

  1. Tajima Sakae (Tokyo JPX) Mouri Takashi (Kanagawa JPX) Morisaki Shigeyoshi (Yokohama JPX), Chromium deposition solution.
  2. Gyllenspetz Jeffrey (Kidderminster EN) Renton Stanley (Penkridge EN), Trivalent chromium electroplating baths and electroplating therefrom.

이 특허를 인용한 특허 (32)

  1. He, Zhian; Ramesh, Ashwin; Ghongadi, Shantinath, Control of current density in an electroplating apparatus.
  2. He, Zhian; Ramesh, Ashwin; Ghongadi, Shantinath, Control of current density in an electroplating apparatus.
  3. He, Zhian; Ramesh, Ashwin; Ghongadi, Shantinath, Control of current density in an electroplating apparatus.
  4. Rousseau, Agnes; Bishop, Craig V., Crystalline chromium alloy deposit.
  5. Bishop, Craig V.; Rousseau, Agnes; Mathe, Zoltan, Crystalline chromium deposit.
  6. Spurlin, Tighe A.; Zhou, Jian; Opocensky, Edward C.; Reid, Jonathan; Mayer, Steven T., Current ramping and current pulsing entry of substrates for electroplating.
  7. Schäfer, Stefan; Richardson, Thomas B., Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates.
  8. Schäfer, Stefan; Richardson, Thomas B., Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates.
  9. Martyak Nicholas M., Deposition of chromium oxides from a trivalent chromium solution containing a complexing agent for a buffer.
  10. Lomasney, Christina, Electrodeposited, nanolaminate coatings and claddings for corrosion protection.
  11. Guilinger Terry R. (Albuquerque NM), Electrodeposition of amorphous ternary nickel-chromium-phosphorus alloy.
  12. Lashmore David S. (Frederick MD) Weisshaus Ilan (Kiryat Bialik ILX) NamGoong Eok (Changwon KRX), Electrodeposition of chromium from a trivalent electrolyte.
  13. Reid, Jonathan D.; Smith, David; Mayer, Steven T.; Henri, Jon; Varadarajan, Sesha, Electroplating process for avoiding defects in metal features of integrated circuit devices.
  14. Schreiber, Christopher; Hahn, Peter; Dunn, Christopher, High strength electrodeposited suspension conductors.
  15. Tateishi Yukio,JPX ; Onoda Motonobu,JPX ; Ogawa Katsuaki,JPX ; Shimizu Kazuo,JPX, Laminated chromium plating layers having superior wear resistance and fatigue strength.
  16. Lasbmore, David S.; Dariel, Moshe P., Method for the production of predetermined concentration graded alloys.
  17. Johnson Christian E. ; Lashmore David ; Soltani Elaine, Methods and electrolyte compositions for electrodepositing metal-carbon alloys.
  18. Komiyama, Shinobu; Yoshida, Masayuki; Yamaguchi, Hidehiro, Process for cold plastic working of metallic materials.
  19. Mayer, Steven T.; Bhaskaran, Vijay; Patton, Evan E.; Jackson, Robert L.; Reid, Jonathan, Process for electroplating metal into microscopic recessed features.
  20. Mayer, Steven T.; Bhaskaran, Vijay; Patton, Evan E.; Jackson, Robert L.; Reid, Jonathan, Process for electroplating metals into microscopic recessed features.
  21. Kelly, James John; Goods, Steven Howard; Yang, Nancy Yuan-Chi; Cadden, Charles Henry, Process for the electrodeposition of low stress nickel-manganese alloys.
  22. Ponnuswamy, Thomas A.; Pennington, Bryan; Berry, Clifford; Buckalew, Bryan L.; Mayer, Steven T., Pulse sequence for plating on thin seed layers.
  23. Lykins ; II James L., Rough electrical contact surface.
  24. Lykins ; II James L., Rough electrical contact surface.
  25. Palumbo, Gino; Davidson, III, William F.; McCrea, Jonathan; Tomantschger, Klaus; Brooks, Iain; Limoges, Dave; Panagiotopoulos, Konstantinos; Erb, Uwe, Sports articles formed using nanostructured materials.
  26. Palumbo, Gino; Brooks, Iain; Panagiotopoulos, Konstantinos; Tomantschger, Klaus; McCrea, Jonathan; Limoges, Dave; Erb, Uwe, Strong, lightweight article containing a fine-grained metallic layer.
  27. Palumbo, Gino; Brooks, Iain; Panagiotopoulos, Konstantinos; Tomantschger, Klaus; McCrea, Jonathan; Limoges, Dave; Erb, Uwe, Strong, lightweight article containing a fine-grained metallic layer.
  28. Palumbo,Gino; Brooks,Iain; Panagiotopoulos,Konstantinos; Tomantschger,Klaus; McCrea,Jonathan; Limoges,David; Erb,Uwe, Strong, lightweight article containing a fine-grained metallic layer.
  29. Palumbo, Gino; Brooks, Iain; Panagiotopoulos, Konstantinos; Tomantschger, Klaus; McCrea, Jonathan; Limoges, Dave; Erb, Uwe, Strong, lightweight article, containing a fine-grained metallic layer.
  30. Battisti, Lorenzo, System and method of plating metal alloys by using galvanic technology.
  31. Ranjan, Manish; Ghongadi, Shantinath; Wilmot, Frederick Dean; Hill, Douglas; Buckalew, Bryan L., Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath.
  32. Ranjan, Manish; Ghongadi, Shantinath; Wilmot, Frederick Dean; Hill, Douglas; Buckalew, Bryan L., Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath.
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