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Semiconductor casing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/52
  • H01L-021/50
  • H01L-023/40
  • H01L-023/10
출원번호 US-0398497 (1982-07-15)
발명자 / 주소
  • Butt Sheldon H. (Godfrey IL)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 35  인용 특허 : 7

초록 ▼

A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base me

대표청구항 ▼

A casing for an electrical component, comprising: a metal base member; a metal lead frame having a first surface disposed adjacent said metal base member and being adapted to have said electrical component connected thereto; a premolded plastic housing member being disposed adjacent a second surface

이 특허에 인용된 특허 (7)

  1. Adachi Hideo (Kyoto JPX) Minai Kiichi (Shiga JPX) Moriyasu Kozo (Muko JPX) Imagawa Shunjiro (Muko JPX), Infrared radiation detecting apparatus and method of manufacturing.
    상세보기
  2. Fichot Julie Y. (Skaneateles NY), Low thermal resistance, low stress semiconductor package.
    상세보기
  3. Grabbe ; Dimitry G., Method for packaging hermetically sealed integrated circuit chips on lead frames.
    상세보기
  4. Krumme ; John F., Method for sealing integrated circuit components with heat recoverable cap and resulting package.
    상세보기
  5. Haas ; Lothar ; Brautigam ; Rolf ; Weckenmann ; Albert, Proximity switch and circuit system.
    상세보기
  6. Miyagaki Katsunori (Tokyo JPX) Noguchi Shozo (Tokyo JPX) Hirakawa Yukio (Tokyo JPX), Semiconductor device having improved high frequency characteristics.
    상세보기
  7. Burns Carmen D. (San Jose CA), Tape operated semiconductor device packaging.
    상세보기

이 특허를 인용한 특허 (35)

  1. Yamanaka Hideo,JPX, Air-packed CCD images package and a mold for manufacturing thereof.
    상세보기
  2. Mahulikar Deepak (Meriden CT) Popplewell James M. (Guilford CT), Aluminum alloy semiconductor packages.
    상세보기
  3. Mahulikar Deepak (Meriden CT) Popplewell James M. (Guilford CT), Aluminum alloy semiconductor packages.
    상세보기
  4. Kitamura, Yukihiro; Takahashi, Takayuki; Ohta, Mitsuru; Ogawa, Yuji, Ceramic circuit board and power module.
    상세보기
  5. Pryor Michael J. (Woodbridge CT) Shapiro Eugene (Hamden CT) Mahulikar Deepak (Meriden CT), Cermet substrate with spinel adhesion component.
    상세보기
  6. Hoffman Paul R. (Modesto CA) Mahulikar Deepak (Madison CT) Brathwaite George A. (Hayward CA) Solomon Dawit (Manteca CA) Parthasarathi Arvind (North Branford CT), Components for housing an integrated circuit device.
    상세보기
  7. Isoda, Takeshi; Shinoda, Koji, Device module and method of manufacturing the same.
    상세보기
  8. Mahulikar Deepak (Madison CT), Electronic package with improved electrical performance.
    상세보기
  9. Newman Robert A., Ground plane for plastic encapsulated integrated circuit die packages.
    상세보기
  10. Lin Lifun (Hamden CT), Hermetic cerglass and cermet electronic packages.
    상세보기
  11. Pryor Michael J. (Woodbridge CT) Eppler Richard A. (Cheshire CT) Smith ; III Edward F. (Madison CT) Butt Sheldon H. (Godfrey IL), Hermetically sealed semiconductor package.
    상세보기
  12. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Integrated circuit (IC) package stacking and IC packages formed by same.
    상세보기
  13. Khan, Rezaur Rahman; Zhao, Sam Ziqun, Interconnect structure and formation for package stacking of molded plastic area array package.
    상세보기
  14. Khan, Rezaur Rahman; Zhao, Sam Ziqun, Interposer for die stacking in semiconductor packages and the method of making the same.
    상세보기
  15. Olson Timothy L. (Phoenix AZ) Carney Lauriann T. (Gilbert AZ) Johnson Gary C. (Tempe AZ) Strom William M. (Chandler AZ), Lead frame assembly for surface mount integrated circuit power package.
    상세보기
  16. Khan, Rezaur Rahman; Wang, Ken Jian Ming, Lead frame-BGA package with enhanced thermal performance and I/O counts.
    상세보기
  17. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Leadframe IC packages having top and bottom integrated heat spreaders.
    상세보기
  18. Mahulikar Deepak (Madison CT) Parthasarathi Arvind (North Branford CT), Leadframe having exposed, solderable outer lead ends.
    상세보기
  19. Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL) Crane Jacob (Woodbridge CT) Pasqualoni Anthony M. (New Haven CT) Smith Edward F. (Madison CT), Metal electronic package.
    상세보기
  20. Mahulikar Deepak (Meriden CT) Braden Jeffrey S. (Milpitas CA) Noe Stephen P. (Stratford CT), Metal electronic package having improved resistance to electromagnetic interference.
    상세보기
  21. Rothgery Eugene F. (No. Branford CT) Hart William W. C. (Bethany CT) Smith ; III Edward F. (Madison CT) Phillips Steven D. (Northford CT) Sandel Bonnie B. (Milford CT) Gavin David F. (Cheshire CT), Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant.
    상세보기
  22. Randy H. Y. Lo ; Boonmi Mekdhanasarn ; Daniel P. Tracy, Method for attaching a lead frame to a heat spreader/heat slug structure.
    상세보기
  23. Butt Sheldon H. (Godfrey IL), Method of making semiconductor casing.
    상세보기
  24. Isoda, Takeshi; Shinoda, Koji, Method of manufacturing a device module.
    상세보기
  25. Zhao, Sam Ziqun; Khan, Reza ur Rahman, Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages.
    상세보기
  26. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages.
    상세보기
  27. Braden Jeffrey S. (Milpitas CA), Multi-layer lead frames for integrated circuit packages.
    상세보기
  28. Zhao, Sam Ziqun; Khan, Rezaur Rahman, No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement.
    상세보기
  29. Smith ; III Edward F. (Madison CT), Sealing glass composite.
    상세보기
  30. Sachs Klaus (Osterode/Harz DEX), Semiconductor circuit packages for use in high power applications and method of making the same.
    상세보기
  31. Sakai Kunito (Amagasaki JPX) Tamaki Akinobu (Amagasaki JPX) Takahama Takashi (Amagasaki JPX), Semiconductor device.
    상세보기
  32. Crane Jacob (Woodbridge CT) Johnson Barry C. (Tucson AZ) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Semiconductor package.
    상세보기
  33. Kim, Jong Man; Kwak, Young Hoon; Oh, Kyu Hwan; Choi, Seog Moon; Kim, Tae Hoon, Semiconductor package substrate.
    상세보기
  34. Butt Sheldon H. (Godfrey IL), Semiconductor packaging.
    상세보기
  35. McMillan John R. (Southlake TX) Maslakow William H. (Lewisville TX) Castro Abram M. (Fort Worth TX), Thermally enhanced chip carrier package.
    상세보기

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