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NTIS 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0574944 (1984-01-30) |
발명자 / 주소 |
|
출원인 / 주소 |
|
인용정보 | 피인용 횟수 : 68 인용 특허 : 2 |
A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bunches of heat conducting strands extend into the
An integrated circuit chips cooling apparatus, comprising: a housing including a board having integrated circuit chips mounted thereon, said chips having a substantially planar surface; means mounted in the housing for separating first and second cooling portions, said separating means including a c
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