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Composites of glass-ceramic to metal seals and method of making the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-017/06
출원번호 US-0369699 (1982-04-19)
발명자 / 주소
  • Butt Sheldon H. (Godfrey IL)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 39  인용 특허 : 3

초록

A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to t

대표청구항

A composite comprising: a fist metal or alloy component having a first thin refractory oxide layer on at least a first surface thereof; a second metal or alloy component having a second thin refractory oxide layer on at least a first surface thereof; and glass or ceramic means having a coefficient o

이 특허에 인용된 특허 (3)

  1. Morisaki Shigeyoshi (Ageo JA) Mase Kazuo (Tokyo JA), Copper foil having bond strength.
  2. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
  3. Lifshin, Eric; Cargioli, Joseph D.; Schroder, Stephen J.; Wong, Joe, Transfer lamination of copper thin sheets and films, method and product.

이 특허를 인용한 특허 (39)

  1. Parthasarathi Arvind ; Jalota Satish ; Schlater Jeffrey ; Strauman Lynn ; Braden Jeffrey S., Aluminum alloys for electronic components.
  2. Mahulikar Deepak (Madison CT) Sagiv Efraim (Meriden CT) Parthasarathi Arvind (North Branford CT) Jalota Satish (Wallingford CT) Brock Andrew J. (Cheshire CT) Holmes Michael A. (Ripon CA) Schlater Jef, Anodized aluminum substrate having increased breakdown voltage.
  3. Pryor Michael J. (Woodbridge CT) Shapiro Eugene (Hamden CT) Mahulikar Deepak (Meriden CT), Cermet substrate with spinel adhesion component.
  4. Butt Sheldon H. (Godfrey IL), Chip carrier.
  5. Charsky Ronald S. (Binghamton NY) Olson Leonard T. (Centreville VA) Pagnani David P. (Apalachin NY), Composite dielectric structure for optimizing electrical performance in high performance chip support packages.
  6. Ransom Christopher J. (Chippenham GBX), Electrical circuits.
  7. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  8. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  9. Hattori, Yoshihiro; Asai, Shozo, Flexible circuit board.
  10. Hattori, Yoshihiro; Asai, Shozo, Flexible circuit board.
  11. Ferguson, John Thomas, Focused LED headlamp with iris assembly.
  12. Mori, Shigetoshi; Ono, Motoshi; Isobe, Mamoru; Horiuchi, Kohei, Glass substrate and glass substrate for high frequency device.
  13. Butt Sheldon H. (Godfrey IL), Hermetically sealed metal package.
  14. Pryor Michael J. (Woodbridge CT) Singhdeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT), Hermetically sealed package.
  15. Pryor Michael J. (Woodbridge CT) Eppler Richard A. (Cheshire CT) Smith ; III Edward F. (Madison CT) Butt Sheldon H. (Godfrey IL), Hermetically sealed semiconductor package.
  16. Pryor Michael J. (Woodbridge CT), Hybrid and multi-layer circuitry.
  17. Pryor Michael J. (Woodbridge CT) Leedecke Charles J. (Northford CT) Masse Norman G. (Wallingford CT), Hybrid and multi-layer circuitry.
  18. Abbatiello, Nicholas D.; Aurongzeb, Deeder M., Information handling system ceramic chassis.
  19. Ogura, Toyoshi; Yamada, Noriko; Kubo, Yuji; Ito, Sawako, Insulating film-coated metal foil.
  20. Robinson Peter W. ; Mahulikar Deepak ; Hoffman Paul R., Metal ball grid electronic package having improved solder joint.
  21. Aurongzeb, Deeder M., Metal ceramic chassis for portable devices.
  22. Butt Sheldon H. (Godfrey IL) Mahulikar Deepak (Meriden CT), Metal packages having improved thermal dissipation.
  23. Cherukuri Satyam C. (West Haven CT), Metal sealing glass composite with matched coefficients of thermal expansion.
  24. Pryor Michael J. (Woodbridge CT), Method for making multi-layer and pin grid arrays.
  25. Ross, Benjamin B.; Jordan, Phillip L.; Strole, Jeffery A., Method of aligning features in a multi-layer electrical connective device.
  26. Singhdeo Narendra N. (New Haven CT) Pryor Michael J. (Woodbridge CT) Leedecke Charles J. (Northford CT) Masse Norman G. (Wallingford CT), Method of manufacturing glass capacitors and resulting product.
  27. Ross, Benjamin B.; Jordan, Phillip L.; Strole, Jeffery A., Method of positioning a conductive element in a laminated electrical device.
  28. Butt Sheldon H. (Godfrey IL), Multi-layer circuitry.
  29. Butt Sheldon H. (Godfrey IL), Multi-layer circuitry.
  30. Smolley Robert, Packaging construction for very large scale integrated-circuit chips.
  31. Butt Sheldon H. (Godfrey IL), Printed circuit board.
  32. Smith ; III Edward F. (Madison CT), Sealing glass composite.
  33. Cherukuri Satyam C. (West Haven CT), Sealing glass for matched sealing of copper and copper alloys.
  34. Cherukuri Satyam C. (West Haven CT) Butt Sheldon H. (Godfrey IL), Semiconductor casing.
  35. Butt Sheldon H. (Godfrey IL), Semiconductor package.
  36. Butt Sheldon H. (Godfrey IL), Semiconductor package.
  37. Crane Jacob (Woodbridge CT) Johnson Barry C. (Tucson AZ) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Semiconductor package.
  38. Butt Sheldon H. (Godfrey IL), Semiconductor packaging.
  39. Jarry Philippe (Sucy-en-Brie FRX) Haji Mohamed L. (Lannion FRX) Guittard Pierre (Montlhery Longpont FRX) Guillemet Bernard (Vitry-sur-Seine FRX) Piaget Claude (Montgeron FRX), Vitreous semiconductor supporting structure and device realized with such a structure.
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