초록 ▼

Production of high bulk nonwoven materials particularly useful as wipers and the like having a varying pattern of bonds and cloth-like feel. In one embodiment the method includes opposed, varying, high density bonding patterns on opposite sides of the materials formed by contact with surfaces having

Production of high bulk nonwoven materials particularly useful as wipers and the like having a varying pattern of bonds and cloth-like feel. In one embodiment the method includes opposed, varying, high density bonding patterns on opposite sides of the materials formed by contact with surfaces having varyingly shaped or sided lands and grooves. Where both surfaces are contacted by such lands and grooves, increased spacing in the unbonded areas permits high loft, essentially unbonded fiber portions between the bond points. Construction of the individual land areas is preferable with tapered sides with vertical so as to permit engraving and high bond density and pattern depth while reducing wear. Resulting products have unique softness and absorbency characteristics for improved wipers because of the bond constructions. In addition, a wide variety of attractive patterns may be obtained. Preferred thermoplastic materials include spunbonded or meltdown polypropylene alone or in combination with wood cellulose and/or staple textile fibers.

대표청구항 ▼

A high-loft nonwoven material having a basis weight in the range of from about 2 oz/yd to about 6 oz/yd comprising a web of thermoplastic filaments having an irregular and essentially nonrepeating pattern of bond areas of varying bond sizes and densities comprising a combination of bond patterns res

A high-loft nonwoven material having a basis weight in the range of from about 2 oz/yd to about 6 oz/yd comprising a web of thermoplastic filaments having an irregular and essentially nonrepeating pattern of bond areas of varying bond sizes and densities comprising a combination of bond patterns resulting in an average bond density of at least 40 bonds per square inch and an average total bond area percent coverage less than 40%.