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특허 상세정보

Disk or wafer handling and coating system

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C23C-015/00   
미국특허분류(USC) 204/298 ; 118/50 ; 118/724 ; 198/339
출원번호 US-0515247 (1983-07-19)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 59  인용 특허 : 4
초록

A system for handling and individually processing a plurality of thin substrates is described. The system includes a main chamber, entrance and exit load locks, a plurality of processing stations, a load lock load/unload means, a vertical transport means, and a horizontal transport means. In one embodiment the processing stations are deployed in a U-shaped configuration, allowing the entrance and exit load locks to be positioned at the same end of the machine. Idle stations between processing stations may also be employed. The substrates are vertically o...

대표
청구항

A system for handling and individually processing a plurality of relatively thin substrates, said substrates being vertically oriented during said handling and processing, said system comprising a main chamber, an entrance load lock and an exit load lock, a plurality of processing stations, load lock load/unload means, vertical transport means, and horizontal transport means, said load locks being positioned above said main chamber and sealed to a top wall thereof, said processing stations being disposed between said load locks and also sealed to said to...

이 특허를 인용한 특허 피인용횟수: 59

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