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Disk or wafer handling and coating system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-015/00
출원번호 US-0515247 (1983-07-19)
발명자 / 주소
  • Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA)
출원인 / 주소
  • Varian Associates, Inc. (Palo Alto CA 02)
인용정보 피인용 횟수 : 59  인용 특허 : 4

초록

A system for handling and individually processing a plurality of thin substrates is described. The system includes a main chamber, entrance and exit load locks, a plurality of processing stations, a load lock load/unload means, a vertical transport means, and a horizontal transport means. In one emb

대표청구항

A system for handling and individually processing a plurality of relatively thin substrates, said substrates being vertically oriented during said handling and processing, said system comprising a main chamber, an entrance load lock and an exit load lock, a plurality of processing stations, load loc

이 특허에 인용된 특허 (4)

  1. Giammanco Rosario P. (Gloucester MA), Article delivery and transport apparatus for evacuated processing equipment.
  2. Kennedy Thomas N. (San Jose CA) Lester William C. (Los Gatos CA) McDonough George W. (Cupertino CA) Michaelsen John D. (Los Gatos CA), Two-sided bias sputter deposition method and apparatus.
  3. Rosvold Warren C. (Sunnyvale CA), Vacuum sputtering apparatus.
  4. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.

이 특허를 인용한 특허 (59)

  1. Hollars Dennis R. (Los Gatos CA) Waltrip Delbert F. (San Jose CA) Zubeck Robert B. (Los Altos CA) Bonigut Josef (Alamo CA) Smith Robert M. (Antioch CA) Payne Gary L. (Sunnyvale CA) Lee Kenneth (Sarat, Apparatus and method for high throughput sputtering.
  2. Tullis Barclay J. (Palo Alto CA) Bailey John S. (Sunnyvale CA) Gunawardena D. R. (Union City CA) Kaempf Ulrich (Los Altos CA), Apparatus for automated cassette handling.
  3. Tullis Barclay J. (Palo Alto CA) Bailey John S. (Sunnyvale CA) Gunawardena D. R. (Union City CA) Kaempf Ulrich (Los Altos CA), Apparatus for automated cassette handling.
  4. Denton Peter R. (Cherry Hill NJ) Boyarsky David (Cherry Hill NJ), Apparatus for coating compact disks.
  5. Beardow Terence (Endenfield GB2), Apparatus for sputter coating discs.
  6. Gallego JosM. (Ormskirk GB2), Apparatus for the deposition of multi-layer coatings.
  7. Mahler Peter (Hainburg DEX), Apparatus for the quasi-continuous treatment of substrates.
  8. Johnson Lester R. (411 Fourth St. Radford VA 24141), Apparatus for transferring semiconductor wafers.
  9. Abe Nobutoshi (Kawasaki JPX) Imamura Kazunori (Tokyo JPX), Automatic photomask or reticle washing and cleaning system.
  10. Mahler Peter (Hainburg DEX), Cathode sputtering apparatus with adjacently arranged stations.
  11. Zejda Jaroslav (Rodenbach DEX), Cathode sputtering system.
  12. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX), Cathode sputtering system.
  13. Aruga Yoshiki,JPX ; Kamikura Yo,JPX, Compact in-line film deposition system.
  14. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX), Device for accepting and holding a workpiece in vacuum coating apparatus.
  15. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Dial deposition and processing apparatus.
  16. Allen Ronald (San Jose CA) Chen Tu (Saratoga CA), Disk and plug.
  17. Allen Ronald (San Jose CA) Chen Tu (Saratoga CA), Disk carrier.
  18. Hughes John L. (Rodeo CA) Shula Thomas E. (Palo Alto CA) Rodriguez Carlos E. (Redwood City CA), Dual track handling and processing system.
  19. Landau Richard F. (Londonderry NH) Millikin Jr. William E. (Acton MA) Puchacz Jerzy P. (Nashua NH) Reyes Manolito Q. (Nashua NH) Schadler Walter (Triesen LIX), High vacuum processing system and method.
  20. Walde Michael (Rodenbach DEX) Zeidler Peter (Hanau DEX) Domroese Dirk (Bispingen-Behringen DEX), Installation for charging and discharging substrates out of a vacuum tank.
  21. Takahashi,Nobuyuki, Interback-type substrate processing device.
  22. White,John M.; Blonigan,Wendell T., Linear vacuum deposition system.
  23. Chen, Jinliang; Nippa, Kinya, Magnetic particle trapper for a disk sputtering system.
  24. Hedgcoth Virgle L., Magnetic recording disk sputtering process and apparatus.
  25. Canady Mickey Lynn (Rochester MN) Edmonson David Alvoid (Rochester MN) Johnson Gary James (Rochester MN) Teig Paul David (Byron MN) Wall Arthur Carl (Rochester MN), Method and apparatus for coating thin film data storage disks.
  26. Wooding Michael J. (Sunnyvale CA) Cardema Rudolfo S. (San Jose CA) Ramiller Charles L. (Santa Clara CA), Method and system for loading wafers.
  27. Gramarossa, Daniel J.; Downes, Gary C., Method of processing and plating planar articles.
  28. Gramarossa, Daniel J.; Downes, Gary C., Method of processing wafers and other planar articles within a processing cell.
  29. Aruga Yoshiki,JPX ; Maeda Koji,JPX, Method of removing accumulated films from the surface of substrate holders in film deposition apparatus, and film deposition apparatus.
  30. Zajac John (San Jose CA) Mirkovich Ninko T. (Novato CA) Rathmann Thomas M. (Rohnert Park CA) Lachenbruch Roger B. (Petaluma CA), Modular article processing machine and method of article handling therein.
  31. Washburn Hudson A. ; Hamilton Jarrett L., Modular deposition system having batch processing and serial thin film deposition.
  32. Washburn Hudson A. ; Hamilton Jarrett L., Modular deposition system having batch processing and serial thin film deposition.
  33. Rubin Richard H. (Fairfield NJ) Petrone Benjamin J. (Netcong NJ) Heim Richard C. (Mountain View CA) Pawenski Scott M. (Wappingers Falls NY), Modular processing apparatus for processing semiconductor wafers.
  34. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
  35. Keigler, Arthur; Goodman, Daniel L.; Guarnaccia, David G., Parallel single substrate marangoni module.
  36. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L., Parallel single substrate processing system.
  37. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L.; Haynes, Jonathan, Parallel single substrate processing system.
  38. Keigler, Arthur, Parallel single substrate processing system with alignment features on a process section frame.
  39. Bloomquist Darrel R. (Boise ID) Drennan George A. (Eagle ID) Opfer James E. (Palo Alto CA), Planetary substrate carrier method and apparatus.
  40. Kokaku Yuichi (Yokohama JPX) Kataoka Hiroyuki (Pallo Alto CA) Kitoh Makoto (Yokohama JPX) Fujimaki Shigehiko (Machida JPX) Matsunuma Satoshi (Yokohama JPX) Furusawa Kenji (Yokohama JPX) Nakagawa Nobu, Plasma processing method and apparatus.
  41. Bluck Terry ; Rogers James H. ; Xie Jun, Plasma processing system and method.
  42. Bluck Terry ; Rogers James H. ; McGinnis Sean P., Processing systems with dual ion sources.
  43. Dobbs Michael E. (Brighton MI) Jones Donald B. (Ann Arbor MI), Robotic substrate manipulator.
  44. Goodwin Dennis L. ; Hawkins Mark R. ; Crabb Richard ; Doley Allan D., Semiconductor processing system with gas curtain.
  45. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA), Sputter module for modular wafer processing system.
  46. Hedgcoth Virgle L. (1524 Hacienda Pl. Pomona CA 91768), Sputtered magnetic thin film recording disk.
  47. Whitesell Andrew B., Substrate handling and processing system and method.
  48. Takahashi, Nobuyuki, Substrate processing device and through-chamber.
  49. Bluck, Terry; Hughes, John Les; Lawson, Eric C.; Tanaka, Tatsuru, Substrate processing system.
  50. Yoshikawa Masato (Kodaira JPX) Kusano Yukihiro (Tokorozawa JPX) Naito Kazuo (Kawasaki JPX) Honda Toshio (Akigawa JPX) Hata Tomonobu (Kanazawa JPX), Surface treatment method.
  51. Bloomquist Darrel R. (Boise ID) Drennan George A. (Eagle ID) Lawton Robert J. (Boise ID) Opfer James E. (Palo Alto CA) Jacobson Michael B. (Boise ID), System and method for depositing plural thin film layers on a substrate.
  52. Harper Guy A. (San Jose CA), System and method for depositing tungsten/titanium films.
  53. Leahey, Patrick; Lawson, Eric; Liu, Charles; Bluck, Terry; Fairbairn, Kevin P.; Ruck, Robert L.; Harkness, IV, Samuel D., System architecture for combined static and pass-by processing.
  54. McLeod, Paul Stephen, Target fabrication method for cylindrical cathodes.
  55. Fukasawa Yoshio (Kofu JPX) Hosoda Shozo (Yamanashi-ken JPX) Nakagome Tatsuya (Yamanashi-ken JPX) Tozawa Takashi (Yamanashi-ken JPX) Suzuki Koji (Yamanashi-ken JPX) Ishihara Yasumasa (Kofu JPX) Aoyagi, Vacuum process apparatus and vacuum processing method.
  56. Soraoka, Minoru; Yoshioka, Ken; Kawasaki, Yoshinao, Vacuum processing apparatus and semiconductor manufacturing line using the same.
  57. Fisher ; Jr. Daniel J. (Chelmsford MA), Wafer handling station.
  58. Garrett, Charles B., Wafer lifting and holding apparatus.
  59. Dimock Jack A. (Santa Barbara CA) Woestenburg Dirk P. (Summerland CA), Wafer processing machine with evacuated wafer transporting and storage system.
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