초록 ▼

Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel d

Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.

대표청구항 ▼

An electrical contact material comprising, in combination: an electrically conductive basis metal layer, an electroless nickel barrier layer deposit over the basis metal layer, and a thin overlayer laid down onto said electroless nickel barrier layer, the thin overlayer being a layer of up to about

An electrical contact material comprising, in combination: an electrically conductive basis metal layer, an electroless nickel barrier layer deposit over the basis metal layer, and a thin overlayer laid down onto said electroless nickel barrier layer, the thin overlayer being a layer of up to about 10 microinches of a precious metal deposit, said combination electrical contact material having contact resistance properties substantially the same as other electrical contact materials having a thick gold overlayer that is significantly thicker than 10 microinches, wherein said barrier layer deposit is an electroless nickel deposit selected from the group consisting of a nickel-boron deposit from an electroless bath including a boron deposition enhancer haing zirconyl or vanadyl ions and a nickel-phosphorus deposit from an electroless bath including an unsaturated carboxylic acid tensile stress reduction agent.