초록 ▼

A heat pipe cooling module assembly (20) for cooling electronic components (28) includes a plurality of heat pipe modules (22) comprising condenser and evaporator sections (24, 26) and working fluid therein. In a preferred embodiment, each evaporator section comprises a sandwich construction of a pa

A heat pipe cooling module assembly (20) for cooling electronic components (28) includes a plurality of heat pipe modules (22) comprising condenser and evaporator sections (24, 26) and working fluid therein. In a preferred embodiment, each evaporator section comprises a sandwich construction of a pair of flat outer plates (34), a pair of wick pads (36) and a separator plate (38) comprising channels extending from the evaporator section into the condenser section.

대표청구항 ▼

A heat pipe cooling module which cools electronic components and which includes condenser and evaporator sections and a working fluid therein, said evaporator section comprising a sandwich construction of a pair of flat outer plates to which the electronic components are to be thermally coupled, at

A heat pipe cooling module which cools electronic components and which includes condenser and evaporator sections and a working fluid therein, said evaporator section comprising a sandwich construction of a pair of flat outer plates to which the electronic components are to be thermally coupled, at least one wick pad adjacent one of said outer plates, and a plurality of spaced bars between said wick pad and the other of said outer plates and extending from said evaporator to said condenser sections to define structural support between said plates for resisting any deformation forces exerted thereon and from consequent decreased heat flow therein and to define a plurality of independent vapor flow channels to said condenser section.