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A thermoelectric temperature control assembly for transferring heat to or from a heat sink. A nonconducting substrate is provided with a plurality of mounting openings for receiving the mounting features of a plurality of respective thermoelectric devices. Each mounting openings is internally partit

A thermoelectric temperature control assembly for transferring heat to or from a heat sink. A nonconducting substrate is provided with a plurality of mounting openings for receiving the mounting features of a plurality of respective thermoelectric devices. Each mounting openings is internally partitioned so as to form a pair of flexible tongues by which the thermoelectric devices may be clamped to a heat sink to assure a good thermal contact therewith.

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A thermoelectric temperature control system for a centrifuge of the type having a rotor, a temperature controlled vessel, and a housing that at least partially encloses the vessel, including: (a) a heat sink positioned under said vessel and supported by said housing, (b) a thermoelectric temperature

A thermoelectric temperature control system for a centrifuge of the type having a rotor, a temperature controlled vessel, and a housing that at least partially encloses the vessel, including: (a) a heat sink positioned under said vessel and supported by said housing, (b) a thermoelectric temperature control assembly comprising: (i) a nonconducting substrate, and (ii) at least one thermoelectric device attached to the substrate, (c) said assembly being positioned between the vessel and the heat sink so that the upper surface of the thermoelectric device is in direct thermal contact with the vessel and the lower surface of the thermoelectric device is in direct thermal contact with the heat sink, (d) whereby the weight of the vessel lessens the thermal resistance of said thermal contacts.