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A composite characterized by a controlled coefficient of thermal expansion and comprising a thermal coefficient control fabric embedded in a resin matrix and composed of yarns with positive and negative coefficients of thermal expansion. A composite circuit board constructed of the composite and hav

A composite characterized by a controlled coefficient of thermal expansion and comprising a thermal coefficient control fabric embedded in a resin matrix and composed of yarns with positive and negative coefficients of thermal expansion. A composite circuit board constructed of the composite and having a coefficient of thermal expansion matched to a particular integrated chip carrier material, such as aluminum oxide.

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A composite comprising: a resin matrix, a woven thermal expansion coefficient control fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said fi

A composite comprising: a resin matrix, a woven thermal expansion coefficient control fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said first group, said first yarns having a positive coefficient of thermal expansion, and said second yarns having a negative coefficient of thermal expansion.