초록 ▼

The support device permits the use of only one type of plate for selecting the different types of integrated circuits having spacing values of 0.3 inch or 0.4 inch or 0.6 inch between the two rows of terminal pins. The plate consists of a parent card in the form of a double-face printed circuit and

The support device permits the use of only one type of plate for selecting the different types of integrated circuits having spacing values of 0.3 inch or 0.4 inch or 0.6 inch between the two rows of terminal pins. The plate consists of a parent card in the form of a double-face printed circuit and of a plurality of daughter cards in the form of a multilayer circuit. The integrated circuits are supported by tulip-type plug sockets disposed at intervals in a number of rows in order to conform to the different spacing values. Each dynamic signal is distributed to the integrated-circuit terminal pins having the same reference number via a protection circuit comprising a diode in series, a voltage-dividing bridge and a diode connected in shunt between the common point and ground. Provision is made for U-link matching means in order to apply instead of the dynamic signal a direct-current supply or a ground when so required by the type of integrated circuit to be selected.

대표청구항 ▼

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising: a plurality of plates for receiving integrated circuits each of said integrated circuits having a plurality of

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising: a plurality of plates for receiving integrated circuits each of said integrated circuits having a plurality of terminal pins with each of said pins having a reference number, wherein said integrated circuit pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins of said integrated circuits having the same reference number, each plate being comprised of a parent card and a plurality P of daughter cards, the said interface connections being formed as a multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the said plates having a similar structure to form only a first, a second and a third version of different plate designs by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said first, second and third versions of plates being each equipped with one type of integrated-circuit socket connector corresponding to one of the spacing standards aforesaid, and the said printed circuits enabling separate and active connection of all the terminal pins of the integrated circuits through the corresponding daughter cards from a single coupling connector located externally of the plate.