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Wafer processing machine 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-015/00
출원번호 US-0564748 (1983-12-22)
발명자 / 주소
  • Dimock Jack A. (Santa Barbara CA)
출원인 / 주소
  • Sputtered Films, Inc. (Santa Barbara CA 02)
인용정보 피인용 횟수 : 50  인용 특허 : 1

초록

A sputter coating machine includes a rectilinearly translatable load-lock door closing off one end of an evacuable chamber. Wafers to be coated are loaded and unloaded by an elevator blade onto a chuck carried from the inside surface of the door. A clamping ring clamps the wafer to the chuck and adv

대표청구항

In a wafer processing machine for processing wafers of the type wherein wafers, in a wafer carrier open on the top and bottom and having slots in the side walls for holding the wafers, are transported to or from the wafer carrier relative to a wafer process station: wafer pickup blade means passing

이 특허에 인용된 특허 (1)

  1. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.

이 특허를 인용한 특허 (50)

  1. Hofmeister, Christopher; Hosek, Martin, Adaptive placement system and method.
  2. Granneman, Ernst H. A., Apparatus and method for atomic layer deposition on substrates.
  3. Weeks Anthony R. (Gilbert AZ) Beasley Todd R. (Tempe AZ) Gordy Craig D. (Scottsdale AZ), Apparatus for holding a piece of semiconductor.
  4. Helms Dirk (Ahrensburg DEX) Katzschner Werner (Berlin DEX) Pawlakowitsch Anton (Alzenau DEX) Anderle Friedrich (Hanau DEX), Apparatus for mounting workpieces.
  5. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W. ; Lane Lawrence C. ; McInerney Edward John, Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition appar.
  6. van de Ven Everhardus P. (Saratoga CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (Saratoga CA) Chin Barry L. (Saratoga CA) Burkhart Christopher W. (Los Gatos CA), Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate.
  7. George Gregory ; Peery Tim ; Consentino Timothy ; Kuhnle Michael ; Wright Seth ; Ziegler James, Automatic modular wafer substrate handling device.
  8. Purushothman, Ganesen; Idris, Fadzli B., Bellows leakage tester and methods for testing bellows.
  9. Aldridge Robert E. (Beaverton OR) Beattie Bruce E. (Portland OR), Cantilever and cold zone assembly for loading and unloading an oven.
  10. Park, Hyung Sang; Choi, Seung Woo; Kim, Jong Su; Jung, Dong Rak; Lee, Jeong Ho; Lee, Chun Soo, Deposition apparatus.
  11. Park, Hyung Sang; Choi, Seung Woo; Kim, Jong Su; Jung, Dong Rak; Lee, Jeong Ho; Lee, Chun Soo, Deposition apparatus.
  12. Keller, Ernst; White, John M.; Tiner, Robin L.; Kucera, Jiri; Choi, Soo Young; Park, Beom Soo; Starr, Michael, Diffuser gravity support.
  13. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W., Gas-based substrate deposition protection.
  14. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson, Horizontal sputtering system.
  15. Fink,Steven T., Hybrid ball-lock attachment apparatus.
  16. Drage David J. (Sebastopol CA) Lachenbruch Roger B. (Sausalito CA) Drake ; Jr. Herbert G. (San Rafael CA) Peavey Jerris H. (Novato CA), Magnetically coupled wafer lift pins.
  17. Soininen, Pekka J.; Lindfors, Sven, Method and apparatus for depositing thin films on a surface.
  18. Lu,Zhimin, Method and apparatus to correct water drift.
  19. Schertler, Roman, Method for manufacturing disk-shaped workpieces with a sputter station.
  20. Liu David,TWX, Method for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers.
  21. Kopacz, Stanislaw; Lawson, John, Method of securing a substrate in a semiconductor processing machine.
  22. Elliott, Martin R.; Shah, Vinay, Methods and apparatus for mapping carrier contents.
  23. Takizawa, Masahiro; Suwada, Masaei, Position sensor system for substrate transfer robot.
  24. Hosek, Martin; Lipcon, Jacob, Robot adaptive placement system with end-effector position estimation.
  25. Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
  26. Kopacz, Stanislaw; Lawson, John, Semiconductor wafer holding assembly.
  27. Raaijmakers, Ivo, Semiconductor wafer position shift measurement and correction.
  28. Raaijmakers,Ivo, Semiconductor wafer position shift measurement and correction.
  29. Lindfors, Sven; Soininen, Pekka Juha, Showerhead assembly and ALD methods.
  30. Roman Schertler AT, Sputter station.
  31. Liu David,TWX, Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers.
  32. Cheng David (San Jose CA) Zhang Wesley W. (Burlingame CA), System and method for detecting the center of an integrated circuit wafer.
  33. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  34. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson, System and method for transporting and sputter coating a substrate in a sputter deposition system.
  35. Kim, Se Yong; Kim, Woo Chan; Jung, Dong Rak, Thin film deposition apparatus and method of maintaining the same.
  36. Kim, Ki Jong; Kim, Dae Youn, Thin film deposition apparatus and method thereof.
  37. Katoh Susumu,JPX, Vacuum processing apparatus.
  38. Yamazaki Koichi,JPX ; Kasai Shigeru,JPX, Vacuum processing apparatus.
  39. Dimock Jack A. (Santa Barbara CA) Woestenburg Dirk P. (Summerland CA), Wafer processing machine with evacuated wafer transporting and storage system.
  40. Layman Frederick P. (Fremont CA) Huntley David A. (Mountain View CA) Dick Paul H. (San Jose CA) Coad George L. (Lafayette CA) Kuhlman Michael J. (Fremont CA) Vecta Roger M. (San Jose CA) Hobson Phill, Wafer processing system.
  41. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R., Wafer support system.
  42. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R., Wafer support system.
  43. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R. ; Van Bilsen Frank B. M. ; Goodman Matthew ; Glenn Hartmann ;, Wafer support system.
  44. Halpin, Michael W.; Hawkins, Mark R.; Foster, Derrick W.; Vyne, Robert M.; Wengert, John F.; van der Jeugd, Cornelius A.; Jacobs, Loren R., Wafer support system.
  45. Halpin, Michael W.; Hawkins, Mark R.; Foster, Derrick W.; Vyne, Robert M.; Wengert, John F.; van der Jeugd, Cornelius A.; Jacobs, Loren R.; Van Bilsen, Frank B. M.; Goodman, Matthew; Glenn, Hartmann; Layton, Jason M., Wafer support system.
  46. Halpin,Michael W.; Hawkins,Mark R.; Foster,Derrick W.; Vyne,Robert M.; Wengert,John F.; van der Jeugd,Cornelius A.; Jacobs,Loren R., Wafer support system.
  47. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  48. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  49. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  50. van de Ven Everhardus P. (Cupertino CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (San Jose CA) Chin Barry L. (Sunnyvale CA) Burkhart Christopher W. (San Jose CA), Wafer surface protection in a gas deposition process.
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