초록 ▼

A novel method of producing a contact device for a switch is disclosed. According to the present invention, a powdered contact alloy material is pressed with a substrate on which is placed the contact material. The resulting molded article is sintered for bonding said contact alloy material to said

A novel method of producing a contact device for a switch is disclosed. According to the present invention, a powdered contact alloy material is pressed with a substrate on which is placed the contact material. The resulting molded article is sintered for bonding said contact alloy material to said substrate. The resulting sintered product is machined to have the shape of a contact and ultimately an electrode bar is attached by brazing to said substrate.

대표청구항 ▼

A method of producing a contact device for a switch comprising the steps of: placing a powdered alloy contact material directly on a main surface and concentrically of a pre-existing disc-shaped substrate pedestal of electrically conductive solid copper or copper alloy metal material and pressing sa

A method of producing a contact device for a switch comprising the steps of: placing a powdered alloy contact material directly on a main surface and concentrically of a pre-existing disc-shaped substrate pedestal of electrically conductive solid copper or copper alloy metal material and pressing said material and substrate pedestal to form a unitarily molded product; sintering said molded product at an elevated temperature no higher than about 1,060 degrees C. to solidify said powdered alloy contact material and to obtain a complete bonding state between said alloy contact material and said substrate pedestal material; machining the sintered product to a desired shape; and brazing an electrode bar to said substrate pedestal.