초록 ▼

An improved header and housing assembly for holding a miniaturized electronic circuit module having a plurality of leads includes a header member having a plurality of apertures arranged to accept the leads of the module. A jaw mechanism associated with each aperture captivates the leads and a prote

An improved header and housing assembly for holding a miniaturized electronic circuit module having a plurality of leads includes a header member having a plurality of apertures arranged to accept the leads of the module. A jaw mechanism associated with each aperture captivates the leads and a protective housing encloses the module between the header member and the housing. An interconnection board which is mounted to a flexible printed circuit board engages the header and housing assembly and forms a base permitting the assembly to be mounted to the flexible circuit board.

대표청구항 ▼

A header and module assembly for holding an electronic circuit module having a sheet of substrate with at least one row of leads which project away from the module, said assembly comprising: a header member having a plurality of apertures arranged in a row so that each aperture accepts one of said l

A header and module assembly for holding an electronic circuit module having a sheet of substrate with at least one row of leads which project away from the module, said assembly comprising: a header member having a plurality of apertures arranged in a row so that each aperture accepts one of said leads of the electronic circuit module; a jaw means adjacent each aperture on said header member for receiving said leads and captivating the module to the header, said leads dimensioned to project substantially beyond the apertures when said sheet of substrate is seated within said channel, thereby allowing a direct electrical connection to be made to the portion of the leads which extend beyond the apertures; and a flexible printed circuit board and a rigid interconnection board mounted to said flexible circuit board, said interconnection board having a plurality of apertures disposed to align with the corresponding apertures in said header member so that said leads of the electronic circuit module are received by the apertures in said interconnection board.