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Interfacial blister bonding for microinterconnections 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-027/00
출원번호 US-0433577 (1982-10-12)
발명자 / 주소
  • Sliwa
  • Jr. John W. (Cupertino CA)
출원인 / 주소
  • Xerox Corporation (Stamford CT 02)
인용정보 피인용 횟수 : 40  인용 특허 : 3

초록

A method for producing microinterconnections including the steps of providing a first support member bearing electrical circuit elements including first electrical contacts and first electrical traces, providing a second support member bearing electrical circuit elements including second electrical

대표청구항

A method for producing microinterconnections characterized by including the following steps, providing a first support member bearing electrical circuit elements including first electrical contact means and first electrical trace means, providing a second support member bearing electrical circuit el

이 특허에 인용된 특허 (3)

  1. Hirata Osamu (Tokyo JPX) Harada Yuji (Tokyo JPX), Desk-top calculator keyboard switch.
  2. Gotman Alexander (Santa Monica CA), Laser bonding of microelectronic circuits.
  3. Eventoff Franklin N. (2351 Lakeview Los Angeles CA 90039) Tcherepnin Serge A. (San Francisco CA), Touch switch keyboard apparatus.

이 특허를 인용한 특허 (40)

  1. Frick, Roger L.; Willcox, Charles R., Capacitive pressure sensing with moving dielectric.
  2. Adamski Joseph R. (Sudbury MA) Ferguson Christopher (Framingham MA) Prifti William E. (Milton MA) Nothe William E. (Billerica MA), Diode laser soldering system.
  3. Sankar Nott G. (Andover MA) Pileeki Victor T. (Townsend MA) Zahaykevich George A. (Watertown MA), Drilling apparatus and method.
  4. Mase Akira (Tokyo JPX) Konuma Toshimitsu (Tokyo JPX) Sakama Mitsunori (Tokyo JPX) Inushima Takashi (Tokyo JPX) Yamazaki Shunpei (Tokyo JPX), Electronic device.
  5. Frick Roger L. ; Louwagie Bennett L. ; Toy Adrian C., Elongated pressure sensor for a pressure transmitter.
  6. Romo, Mark G.; Rud, Jr., Stanley E.; Lutz, Mark A.; Sittler, Fred C.; Toy, Adrian C., Grain growth of electrical interconnection for microelectromechanical systems (MEMS).
  7. Massit Claude (Saint-Ismier FRX) Nicolas Gerard (Voreppe FRX) Parat Guy (Echirolles FRX), Heating device for embodying connections by a meltable material.
  8. Tai King L. (Berkeley Heights NJ), Integrated circuit chip-and-substrate assembly.
  9. Rosenblatt, Sami; Orcutt, Jason S., Laser annealing of qubits with structured illumination.
  10. Phipps, Claude R.; Luke, James, Laser plasma thruster.
  11. Tsui, Ting Yiu, Laser-assisted silicide fuse programming.
  12. Kim, Sung Kyoon; Kim, Myeong Soo; Lim, Woo Sik; Na, Min Gyu; Choo, Sung Ho, Light emitting device, light emitting device package, and lighting system.
  13. Kim, Sung Kyoon; Lim, Woo Sik; Kim, Myeong Soo; Choo, Sung Ho; Na, Min Gyu, Light emitting device, light emitting device package, and lighting system.
  14. Lutz, Mark A.; Frick, Roger; Sittler, Fred C.; Toy, Adrian C., Method and apparatus for a direct bonded isolated pressure sensor.
  15. Hubbard Richard F. ; Fisher Amnon, Method and apparatus for ablative bonding using a pulsed electron.
  16. Gaynes Michael Anthony ; Pierson Mark Vincent ; Zubelewicz Aleksander, Method for reinforcing a semiconductor device to prevent cracking.
  17. Spletter Phillip J. (Cedar Park TX) MacKay Colin A. (Austin TX), Method of laser bonding electrical members.
  18. Mead, Donald I.; Pierson, Mark V., Method of making electrically conductive contacts on substrates.
  19. Fujimoto Masayuki,JPX ; Nakazawa Matsuo,JPX ; Takahashi Hiroshi,JPX ; Suzuki Kazutaka,JPX ; Isuzuku Koichiro,JPX, Method of manufacturing circuit module.
  20. Fjelstad, Joseph; Beroz, Masud; Smith, John W.; Haba, Belgacem, Microelectric packages having deformed bonded leads and methods therefor.
  21. Masud Beroz ; Joseph Fjelstad ; Belgacem Haba ; Christopher M. Pickett ; John Smith, Microelectronic unit forming methods and materials.
  22. John W. Smith ; Belgacem Haba, Multi-layer substrates and fabrication processes.
  23. Smith, John W.; Haba, Belgacem, Multi-layer substrates and fabrication processes.
  24. Smolley Robert, Packaging construction for very large scale integrated-circuit chips.
  25. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
  26. Sittler, Fred C.; Nord, Christina A.; Romo, Mark G., Pressure sensor assembly.
  27. Sittler, Fred C., Pressure sensor capsule with improved isolation.
  28. Frick Roger L. ; Louwagie Bennett L. ; Toy Adrian C., Pressure sensor cavity etched with hot POCL.sub.3 gas.
  29. Fred C. Sittler ; Roger Frick, Pressure sensor for a pressure transmitter.
  30. DiStefano,Thomas H.; Smith,John W.; Faraci,Tony, Semiconductor package with heat sink.
  31. Gravel, James L.; Sittler, Fred C.; Broden, David A., Sensor with fluid isolation barrier.
  32. Frick Roger L. ; Louwagie Bennett L. ; Toy Adrian C., Sintered pressure sensor for a pressure transmitter.
  33. Toshiharu Furukawa ; Mark C. Hakey ; Steven J. Holmes ; David V. Horak ; H. Bernhard Pogge ; Edmund J. Sprogis ; Steven H. Voldman, Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage.
  34. Michael Anthony Gaynes ; Mark Vincent Pierson ; Aleksander Zubelewicz, Structure for reinforcing a semiconductor device to prevent cracking.
  35. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  36. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  37. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  38. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  39. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.
  40. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.
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