초록 ▼

A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450° C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt. % vitreous solder glass powder of PbO-B 2 O 3 system having a deformation point of 350° C. or less,

A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450° C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt. % vitreous solder glass powder of PbO-B 2 O 3 system having a deformation point of 350° C. or less, 1-35 wt. % first ceramic powder and 1-45 wt. % second ceramic powder. The total amount of the first and second ceramic powders is 20-50 wt. %. The first ceramic comprises 68-75 wt. % ZnO, 23-28 wt. % SiO 2 and 0-8 wt. % Al 2 O 3, and the second ceramic comprises 98-99.9 wt. % SnO 2 and 0.1-2 wt. % ZnO.

대표청구항 ▼

1. A low temperature sealing composition for a seal of high mechanical strength between two alumina ceramic parts to form a sealed package having a shearing strength of at least 310 kg, the sealing composition having a sealing temperature of no more than 450° C. and consisting essentially of a mixtu

1. A low temperature sealing composition for a seal of high mechanical strength between two alumina ceramic parts to form a sealed package having a shearing strength of at least 310 kg, the sealing composition having a sealing temperature of no more than 450° C. and consisting essentially of a mixture of 50-80 wt.% of a vitreous solder glass powder of PbO-B 2 O 3 system having a deformation point of 350° C. or less, 1-35 wt.% of a first ceramic powder and 1-45 wt.% of a second ceramic powder, the total amount of said first and second ceramic powders being 20-50 wt.%, said first ceramic powder consisting of 68-75 wt.% ZnO, 23-28 wt.% SiO 2 and up to 8 wt.% Al 2 O 3, and said second ceramic powder consisting of 98-99.9 wt.% SnO 2 and 0.1-2 wt.% ZnO. 2. A low temperature sealing composition as claimed in claim 1, wherein said solder glass powder consists of 80-86 wt.% PbO, 11.0-13.0 wt.% B 2 O 3, 0.5-2.0 wt.% SiO 2, 0-5 wt.% ZnO, 0-2 wt.% Al 2 O 3, and 0-2 wt.% F 2 . 3. A low temperature sealing composition as claimed in claim 1, wherein said solder glass powder is fine enough to pass a standard 150 mesh screen. 4. A low temperature sealing composition as claimed in claim 1, wherein said first ceramic powder is fine enough to pass a standard 325 mesh screen. 5. A low temperature sealing composition as claimed in claim 1, wherein said second ceramic powder is fine enough to pass a standard 325 mesh screen.