초록 ▼

The present invention is directed to aqueous phenol formaldehyde resoles that have particular application in manufacturing phenolic foam insulation. The resoles are essentially phenol formaldehyde condensation polymers having molar ratios of formaldehyde to phenol of from about 1.7:1 to 2.3:1, prefe

The present invention is directed to aqueous phenol formaldehyde resoles that have particular application in manufacturing phenolic foam insulation. The resoles are essentially phenol formaldehyde condensation polymers having molar ratios of formaldehyde to phenol of from about 1.7:1 to 2.3:1, preferably from 1.75:1 to 2.25:1 and most preferably about 2:1. The resoles have a weight average molecular weight greater than 800 and preferably from 950-1500. The resoles also have a number average molecular weight greater than 350 and preferably from about 400 to about 600 and a dispersivity greater than about 1.7, preferably from 1.8 to 2.6. Phenol formaldehyde resoles having these characteristics are processable into phenolic foams having a low k value and having other physical characteristics which make the phenolic foam especially useful as an insulation material. The present invention is also directed to foamable phenolic resole compositions prepared from the phenolic resoles and phenolic foams prepared from the compositions.

대표청구항 ▼

1. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said

1. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.7:1 to about 2.3:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 2. An improved process as in claim 1 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 3. An improved process as in claim 1 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 4. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.7:1 to 2.3:1, a weight average molecular weight between about 950 and 1500, a number average molecular weight between about 400 and 600, a dispersivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 5. An improved process as in claim 4 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight. 6. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.75:1 to about 2.25:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 7. An improved process as in claim 6 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 8. An improved process as in claim 6 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 9. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.75:1 to 2.25:1, a weight average molecular weight between about 950 and 1500, a number average molecular weight between about 400 and 600, a dispersitivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 10. An improved process as in claim 9 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight. 11. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of about 2:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 12. An improved process as in claim 11 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 13. An improved process as in claim 11 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 14. An improved process for preparing closed cell phenolic foam having entrapped fluorocarbon blowing agent comprising preparing a foamable phenolic resole composition comprising aqueous phenol formaldehyde resole, surfactant, fluorocarbon blowing agent and acid catalyst, and foaming and curing said composition in a substantially closed mold wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of about 2:1, a weight average molecular weight between about 950 and 1500, a number average molecular weight between about 400 and 600, a dispersivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 15. An improved process as in claim 14 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight. 16. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.7:1 to about 2.3:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 17. An improved foamable phenolic resole composition as in claim 16 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 18. An improved foamable phenolic resole composition as in claim 16 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 19. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.7:1 to 2.3:1, a weight average molecular weight between about 950 and 1500, a number average molecular weight between about 400 and 600, a dispersivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 20. An improved foamable phenolic resole composition as in claim 19 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight. 21. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.75:1 to 2.25:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 22. An improved foamable phenolic resole composition as in claim 21 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 23. An improved foamable phenolic resole composition as in claim 21 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 24. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of from about 1.75:1 to 2.25:1, a weight average molecular weight between 950 and 1500, a number average molecular weight between about 400 and 600, a dispersivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 25. An improved foamable phenolic resole composition as in claim 24 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight. 26. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of about 2:1, a weight average molecular weight greater than about 800, a number average molecular weight greater than about 350, a dispersivity greater than about 1.7 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 27. An improved foamable phenolic resole composition as in claim 26 wherein the weight average molecular weight of the phenol formaldehyde resole is between about 950 and 1500. 28. An improved foamable phenolic resole composition as in claim 26 wherein the number average molecular weight of the phenol formaldehyde resole is between about 400 and 600. 29. An improved foamable phenolic resole composition for preparing closed cell phenolic foam comprising an aqueous phenol formaldehyde resole, surfactant, blowing agent and acid catalyst wherein the improvement comprises a phenol formaldehyde resole having a molar ratio of formaldehyde to phenol of about 2:1, a weight average molecular weight between about 950 and 1500, a number average molecular weight between about 400 and 600, a dispersivity between about 1.8 and 2.6 and wherein the content of free formaldehyde and free phenol are each less than 7 percent by weight. 30. An improved foamable phenolic resole composition as in claim 29 wherein the content of free formaldehyde and free phenol are each less than 4 percent by weight.