초록 ▼

An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing

An offset weld ring is brazed or soldered to the top surface of a flat pack frame to provide an offset weld surface for the welding of a lid to the package in which the heat applied during the welding process is moved away from the glass feedthroughs in the package, thereby permitting closer spacing of the lid to the glass feedthrough for minimizing overall package height and obtaining a low profile package.

대표청구항 ▼

1. A method of minimizing package height for microcircuit packages comprising the steps of: providing a flat pack frame having at least one wall carrying at least one feedthrough; affixing an offset weld ring to the top surface of the flat pack frame, the weld ring extending past the wall of the

1. A method of minimizing package height for microcircuit packages comprising the steps of: providing a flat pack frame having at least one wall carrying at least one feedthrough; affixing an offset weld ring to the top surface of the flat pack frame, the weld ring extending past the wall of the flat pack frame carrying a feedthrough; and welding a lid to the offset weld ring at the periphery of the weld ring, whereby the heat of welding is removed from the feedthrough such that the distance between the top of the feedthrough to the top surface of the frame can be minimized. 2. The method of claim 1 wherein the lid is stepped at its periphery. 3. The method of claim 2 wherein the offset weld ring and the frame are made of the same material. 4. The method of claim 3 wherein said material is nickel-iron-cobalt alloy. 5. The method of claim 1 wherein the periphery of the lid matches that of the offset weld ring. 6. The method of claim 1 wherein the offset weld ring includes an annular weld projection. 7. The method of claim 1 wherein the offset weld ring is brazed to the frame. 8. The method of claim 1 wherein the offset weld ring is soldered to the frame. 9. The microcircuit package comprising: a rectangular frame having at least one upstanding well and an annular top surface such that said frame surrounds a predetermined area; a feedthrough mounted through said wall; a base secured to said frame; a separate offset weld ring secured to the top surface of said frame, said weld ring extending past the wall carrying said feedthrough; and a lid welded to the periphery of said weld ring. 10. The package of claim 9 wherein said lid is stepped at its periphery so that the central portion thereof extends into the area surrounded by said frame. 11. The package of claim 9 wherein said ring includes an annular weld projection. 12. The package of claim 9 wherein said ring, frame and lid are of nickel-iron-cobalt alloy and wherein the distance between the top of a feedthrough and the top surface of said frame is 15 thousandths of an inch.